Inventor
JOI ANIRUDDHA
US15 patents
Patents
15 patentsUS10163695B1Dec 25, 2018
Self-forming barrier process
LAM RES CORP7 citations83
US9469902B2Oct 18, 2016
Electroless deposition of continuous platinum layer
LAM RES CORP13 citations80
US10483163B2Nov 19, 2019
Self-forming barrier process
LAM RES CORP2 citations72
US10501846B2Dec 10, 2019
Electrochemical doping of thin metal layers employing underpotential deposition and thermal treatment
LAM RES CORP4 citations71
US9428836B2Aug 30, 2016
Electroless deposition of continuous cobalt layer using complexed Ti3+ metal ions as reducing agents
LAM RES CORP3 citations68
US12564039B2Feb 24, 2026
Doping processes in metal interconnect structures
LAM RES CORP0 citations61
US11984354B2May 14, 2024
Zincating and doping of metal liner for liner passivation and adhesion improvement
LAM RES CORP0 citations61
US11225714B2Jan 18, 2022
Electrochemical doping of thin metal layers employing underpotential deposition and thermal treatment
LAM RES CORP0 citations60
US12278112B2Apr 15, 2025
Multiple state pulsing for high aspect ratio etch
LAM RES CORP1 citations59
US11424158B2Aug 23, 2022
Metal liner passivation and adhesion enhancement by zinc doping
LAM RES CORP0 citations57
US10508351B2Dec 17, 2019
Layer-by-layer deposition using hydrogen
LAM RES CORP0 citations51
US10640874B2May 5, 2020
Selective electroless electrochemical atomic layer deposition in an aqueous solution without external voltage bias
LAM RES CORP0 citations50
US9476124B2Oct 25, 2016
Selective deposition and co-deposition processes for ferromagnetic thin films
LAM RES CORP0 citations50
US9499913B2Nov 22, 2016
Electroless deposition of continuous platinum layer using complexed Co2+ metal ion reducing agent
LAM RES CORP1 citations49
US10741440B2Aug 11, 2020
Metal liner passivation and adhesion enhancement by zinc doping
LAM RES CORP0 citations47