Inventor
TU MING-TE
TW28 patents
⚠️ This page may combine multiple inventors who share the name “TU MING-TE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LINGSEN PREC INDUSTRIES LTD
13 patentsUS11410856B2Aug 9, 2022
Chip packaging method
LINGSEN PREC INDUSTRIES LTD0 citations61
US10696543B1Jun 30, 2020
Waterproof MEMS chip package structure
LINGSEN PREC INDUSTRIES LTD1 citations55
US9905548B2Feb 27, 2018
Optical module integrated package
LINGSEN PREC INDUSTRIES LTD0 citations50
US11041774B2Jun 22, 2021
Pressure sensor package
LINGSEN PREC INDUSTRIES LTD1 citations49
US10396234B2Aug 27, 2019
Package structure of long-distance sensor and packaging method of the same
LINGSEN PREC INDUSTRIES LTD0 citations45
US10312169B1Jun 4, 2019
Substrate and package module including the same
LINGSEN PREC INDUSTRIES LTD0 citations45
US10103286B2Oct 16, 2018
Packaging method of long-distance sensor
LINGSEN PREC INDUSTRIES LTD0 citations45
US10003874B2Jun 19, 2018
Microphone package structure
LINGSEN PREC INDUSTRIES LTD0 citations39
US9952089B2Apr 24, 2018
Optical sensing module and method of manufacturing the same
LINGSEN PREC INDUSTRIES LTD0 citations38
US10362377B2Jul 23, 2019
MEMS microphone package
LINGSEN PREC INDUSTRIES LTD0 citations37
US10362406B2Jul 23, 2019
MEMS microphone package
LINGSEN PREC INDUSTRIES LTD0 citations37
US10299046B2May 21, 2019
MEMS microphone package
LINGSEN PREC INDUSTRIES LTD0 citations37
US10090427B2Oct 2, 2018
Package structure of long-distance sensor and packaging method of the same
LINGSEN PREC INDUSTRIES LTD0 citations35
LINGSEN PRECISION IND LTD
11 patentsUS8362496B1Jan 29, 2013
Optical module package unit
LINGSEN PRECISION IND LTD54 citations93
US9449955B2Sep 20, 2016
Optical module integrated package
LINGSEN PRECISION IND LTD6 citations82
US9190398B2Nov 17, 2015
Method for packaging an optical module
LINGSEN PRECISION IND LTD7 citations82
US9260298B1Feb 16, 2016
Stacked MEMS microphone packaging method
LINGSEN PRECISION IND LTD11 citations81
US9705025B2Jul 11, 2017
Package structure of an optical module
LINGSEN PRECISION IND LTD4 citations73
US9647178B2May 9, 2017
Package structure of optical module having printed shielding layer and its method for packaging
LINGSEN PRECISION IND LTD4 citations71
US9478693B2Oct 25, 2016
Optical module package and its packaging method
LINGSEN PRECISION IND LTD2 citations62
US9312402B2Apr 12, 2016
Micro optical package structure with filtration layer and method for making the same
LINGSEN PRECISION IND LTD2 citations60
US9416930B2Aug 16, 2016
LED lamp strip and manufacturing process thereof
LINGSEN PRECISION IND LTD2 citations58
US9618415B2Apr 11, 2017
Pressure sensor package
LINGSEN PRECISION IND LTD0 citations50
US9309108B2Apr 12, 2016
MEMS microphone packaging method
LINGSEN PRECISION IND LTD0 citations39