Inventor
JIANG ZHENGUO
US9 patents
Patents
9 patentsUS11107757B2Aug 31, 2021
Integrated circuit structures in package substrates
INTEL CORP2 citations71
US10672693B2Jun 2, 2020
Integrated circuit structures in package substrates
INTEL CORP2 citations71
US11937367B2Mar 19, 2024
Radio frequency front-end structures
INTEL CORP2 citations68
US11804426B2Oct 31, 2023
Integrated circuit structures in package substrates
INTEL CORP0 citations60
US12003023B2Jun 4, 2024
In-package 3D antenna
INTEL CORP0 citations59
US12200855B2Jan 14, 2025
Radio frequency front-end structures
INTEL CORP0 citations58
US11729902B2Aug 15, 2023
Radio frequency front-end structures
INTEL CORP0 citations58
US11482471B2Oct 25, 2022
Thermal management solutions for integrated circuit packages
INTEL CORP0 citations51
US11611164B2Mar 21, 2023
Wideband multi-pin edge connector for radio frequency front end module
INTEL CORP0 citations50