Inventor

LEE JANGWOO

KR47 patents

⚠️ This page may combine multiple inventors who share the name “LEE JANGWOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEE JANGWOO

SAMSUNG ELECTRONICS CO LTD

Integrated circuit and storage device including the same

Display screen or portion thereof with graphical user interface

Method and electronic device for providing multi-access edge computing service using multi-access edge computing discovery

Semiconductor packages and methods of forming the same

Memory device including interface circuit and method of operating the same

Memory device and memory system including the same

Parameter monitoring circuit for detecting error of parameter, duty cycle correction circuit, and impedance calibration circuit

Integrated circuit and storage device including integrated circuit

Method and electronic device for providing multi-access edge computing service using multi-access edge computing discovery

Display screen or portion thereof with graphical user interface

Interface chip used to select memory chip and storage device including interface chip and memory chip

Electronic device determining setting value of device based on at least one of device information or environment information and controlling method thereof

Electronic apparatus and operating method thereof

Equipment for manufacturing semiconductor devices and method for use of same for manufacturing semiconductor package components

Memory device including interface circuit and method of operating the same

Memory device and memory system including the same

Memory device including interface circuit and method of operating the same

Interface circuit, memory device, storage device, and method of operating the memory device

Storage device and retraining method thereof

Memory device and memory system including the same

Memory device and memory system including the same

Storage device and retraining method thereof

Memory device including interface circuit and method of operating the same

Interface circuit for processing commands, memory device including the same, storage device, and method of operating the memory device

Semiconductor package having second pad electrically connected through the interposer chip to the first pad

Semiconductor packages having a dam structure

Semiconductor packages having a dam structure

Method of operating a system including a parameter monitoring circuit

Thermal interface material layer and package-on-package device including the same

Electronic device and controlling method thereof

Display device and control method thereof

Terminal device and cooking apparatus control system

Method of shaping a strobe signal, a data storage system and strobe signal shaping device

Method of shaping a strobe signal, a data storage system and strobe signal shaping device

Thermal interface material layer and package-on-package device including the same

Use method according to folding state of display, and electronic apparatus using same

Semiconductor package device

Electronic device and method for controlling multi-wireless charging

LG ELECTRONICS INC

Air conditioner and method of operating the same

Air conditioner with ionizer

KIM JONGKOOK

Package-on-package devices and methods of manufacturing the same

KIM TONGSUK

Semiconductor packages and methods of forming the same

NA MIN OK

Thermal interface material layer and package-on-package device including the same

LEE YUNHI

Compressor with oil level controller

KIM CHUL BUM

Data transmitting and receiving apparatus and method, and solid state drive including the same

SHIN JINHYOUK

Plasma enhanced chemical vapor deposition apparatus and method for controlling the same

OH JUNGGEUN

Plasma enhanced chemical vapor deposition apparatus and method for controlling the same