Inventor

CHOI KYOUNGSEI

KR23 patents

⚠️ This page may combine multiple inventors who share the name “CHOI KYOUNGSEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHOI KYOUNGSEI

SAMSUNG ELECTRONICS CO LTD

Semiconductor package and method of fabricating the same

Tape wiring substrates and packages including the same

Semiconductor packages having semiconductor chips disposed in opening in shielding core plate

Semiconductor packages and methods of forming the same

Semiconductor package including an interposer and method of fabricating the same

Semiconductor package including an in interposer and method of fabricating the same

Semiconductor package with interposer

Stacked image sensor package and stacked image sensor module including the same

Semiconductor package and method of fabricating the same

Method of fabricating semiconductor package

Semiconductor packages having semiconductor chips disposed in opening in shielding core plate

Semiconductor packages having semiconductor chips disposed in opening in shielding core plate

Methods of manufacturing semiconductor packages

Semiconductor package including an interposer and method of fabricating the same

Stacked image sensor package and stacked image sensor module including the same

Semiconductor packages

Semiconductor device and method of manufacturing the same

Semiconductor package, and package on package having the same

Semiconductor package including an embedded semiconductor device

KIM JAE CHOON

Semiconductor devices and methods of controlling temperature thereof

KIM JONGKOOK

Package-on-package devices and methods of manufacturing the same

KIM TONGSUK

Semiconductor packages and methods of forming the same

CHO YOUNGSANG

Semiconductor package