Inventor
LEONG CHEE SENG
MY12 patents
⚠️ This page may combine multiple inventors who share the name “LEONG CHEE SENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
8 patentsUS10886218B2Jan 5, 2021
Fabric die to fabric die interconnect for modularized integrated circuit devices
INTEL CORP12 citations92
US11670589B2Jun 6, 2023
Fabric die to fabric die interconnect for modularized integrated circuit devices
INTEL CORP4 citations84
US12009298B2Jun 11, 2024
Fabric die to fabric die interconnect for modularized integrated circuit devices
INTEL CORP2 citations71
US10200046B1Feb 5, 2019
High resolution and low power interpolator for delay chain
INTEL CORP4 citations71
US12394713B2Aug 19, 2025
Fabric die to fabric die interconnect for modularized integrated circuit devices
INTEL CORP0 citations61
US11043942B2Jun 22, 2021
Variable delay circuits and methods
INTEL CORP0 citations61
US10333504B2Jun 25, 2019
Low power clamp for electrical overstress protection
INTEL CORP0 citations51
US10848155B2Nov 24, 2020
Flexible transmitter circuitry for integrated circuits
INTEL CORP0 citations50