Inventor
SHIU KUEN-TING
US105 patents
⚠️ This page may combine multiple inventors who share the name “SHIU KUEN-TING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
37 patentsUS9287362B1Mar 15, 2016
Vertical field effect transistors with controlled overlap between gate electrode and source/drain contacts
IBM62 citations98
US8937299B2Jan 20, 2015
III-V finFETs on silicon substrate
IBM40 citations93
US9608160B1Mar 28, 2017
Polarization free gallium nitride-based photonic devices on nanopatterned silicon
IBM19 citations84
US9564494B1Feb 7, 2017
Enhanced defect reduction for heteroepitaxy by seed shape engineering
IBM9 citations84
US9496347B1Nov 15, 2016
Graded buffer epitaxy in aspect ratio trapping
IBM7 citations84
US9431301B1Aug 30, 2016
Nanowire field effect transistor (FET) and method for fabricating the same
IBM11 citations84
US9397226B2Jul 19, 2016
Vertical field effect transistors with controlled overlap between gate electrode and source/drain contacts
IBM12 citations84
US9344200B2May 17, 2016
Complementary metal oxide semiconductor device with III-V optical interconnect having III-V epitaxial semiconductor material formed using lateral overgrowth
IBM5 citations84
US9123569B1Sep 1, 2015
Complementary metal-oxide-semiconductor structure with III-V and silicon germanium transistors on insulator
IBM7 citations84
US9059075B2Jun 16, 2015
Selective gallium nitride regrowth on (100) silicon
IBM7 citations84
US9048173B2Jun 2, 2015
Dual phase gallium nitride material formation on (100) silicon
IBM12 citations84
US8975635B2Mar 10, 2015
Co-integration of elemental semiconductor devices and compound semiconductor devices
IBM11 citations84
US8841177B2Sep 23, 2014
Co-integration of elemental semiconductor devices and compound semiconductor devices
IBM11 citations84
US8772116B2Jul 8, 2014
Dielectric equivalent thickness and capacitance scaling for semiconductor devices
IBM11 citations83
US10043663B2Aug 7, 2018
Enhanced defect reduction for heteroepitaxy by seed shape engineering
IBM2 citations73
US9887264B2Feb 6, 2018
Nanowire field effect transistor (FET) and method for fabricating the same
IBM3 citations73
US9595805B2Mar 14, 2017
III-V photonic integrated circuits on silicon substrate
IBM2 citations73
US9548355B1Jan 17, 2017
Compound finFET device including oxidized III-V fin isolator
IBM5 citations73
US9406566B1Aug 2, 2016
Integration of III-V compound materials on silicon
IBM5 citations73
US9401583B1Jul 26, 2016
Laser structure on silicon using aspect ratio trapping growth
IBM5 citations73
US9093532B2Jul 28, 2015
Overlapped III-V finFET with doped semiconductor extensions
IBM5 citations73
US9059232B2Jun 16, 2015
T-shaped compound semiconductor lateral bipolar transistor on semiconductor-on-insulator
IBM4 citations73
US9570296B2Feb 14, 2017
Preparation of low defect density of III-V on Si for device fabrication
IBM1 citations63
US9406530B2Aug 2, 2016
Techniques for fabricating reduced-line-edge-roughness trenches for aspect ratio trapping
IBM2 citations63
US9395489B2Jul 19, 2016
Complementary metal oxide semiconductor device with III-V optical interconnect having III-V epitaxially formed material
IBM2 citations63
US9318641B2Apr 19, 2016
Nanowires formed by employing solder nanodots
IBM2 citations63
US9263626B1Feb 16, 2016
Crystalline thin film photovoltaic cell
IBM2 citations63
US9159822B2Oct 13, 2015
III-V semiconductor device having self-aligned contacts
IBM3 citations63
US9099381B2Aug 4, 2015
Selective gallium nitride regrowth on (100) silicon
IBM2 citations63
US9070617B2Jun 30, 2015
Reduced S/D contact resistance of III-V mosfet using low temperature metal-induced crystallization of n+ Ge
IBM3 citations63
US9059288B2Jun 16, 2015
Overlapped III-V finfet with doped semiconductor extensions
IBM2 citations63
US9059271B2Jun 16, 2015
Self-aligned III-V MOSFET fabrication with in-situ III-V epitaxy and in-situ metal epitaxy and contact formation
IBM2 citations63
US8946054B2Feb 3, 2015
Crack control for substrate separation
IBM2 citations63
US8927398B2Jan 6, 2015
Group III nitrides on nanopatterned substrates
IBM2 citations63
US8796120B2Aug 5, 2014
High throughput epitaxial lift off for flexible electronics
IBM2 citations63
US11916130B2Feb 27, 2024
Direct growth of lateral III-V bipolar transistor on silicon substrate
IBM0 citations62
US10998420B2May 4, 2021
Direct growth of lateral III-V bipolar transistor on silicon substrate
IBM0 citations62
CHENG CHENG-WEI
5 patentsUS8492187B2Jul 23, 2013
High throughput epitaxial liftoff for releasing multiple semiconductor device layers from a single base substrate
CHENG CHENG-WEI4 citations73
US8828824B2Sep 9, 2014
III-V field effect transistory (FET) and III-V semiconductor on insulator (IIIVOI) FET, integrated circuit (IC) chip and method of manufacture
CHENG CHENG-WEI2 citations62
US8822317B2Sep 2, 2014
Self-aligned III-V MOSFET diffusion regions and silicide-like alloy contact
CHENG CHENG-WEI2 citations62
US8482033B2Jul 9, 2013
High throughput epitaxial liftoff for releasing multiple semiconductor device layers from a single base substrate
CHENG CHENG-WEI3 citations62
US8466493B2Jun 18, 2013
Self-aligned III-V field effect transistor (FET), integrated circuit (IC) chip with self-aligned III-V FETS and method of manufacture
CHENG CHENG-WEI2 citations62
GLOBALFOUNDRIES INC
2 patentsUNIV MICHIGAN
1 patentFRANK MARTIN M
1 patentUNIV PRINCETON
1 patentGUO DECHAO
1 patentKIM JEEHWAN
1 patentFOGEL KEITH E
1 patentShowing the top 50 of 105 patents by PatentIndex Score.