Inventor
LEE WILLIAM T
US19 patents
⚠️ This page may combine multiple inventors who share the name “LEE WILLIAM T”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
9 patentsUS9184060B1Nov 10, 2015
Plated metal hard mask for vertical NAND hole etch
LAM RES CORP26 citations92
US8673779B1Mar 18, 2014
Interconnect with self-formed barrier
LAM RES CORP24 citations89
US9418889B2Aug 16, 2016
Selective formation of dielectric barriers for metal interconnects in semiconductor devices
LAM RES CORP8 citations84
US10262943B2Apr 16, 2019
Interlevel conductor pre-fill utilizing selective barrier deposition
LAM RES CORP7 citations83
US9583386B2Feb 28, 2017
Interlevel conductor pre-fill utilizing selective barrier deposition
LAM RES CORP8 citations83
US10128116B2Nov 13, 2018
Integrated direct dielectric and metal deposition
LAM RES CORP2 citations73
US9875968B2Jan 23, 2018
Interlevel conductor pre-fill utilizing selective barrier deposition
LAM RES CORP2 citations72
US8828863B1Sep 9, 2014
Electroless copper deposition with suppressor
LAM RES CORP6 citations69
US9006893B2Apr 14, 2015
Devices for metallization
LAM RES CORP2 citations63