Inventor
PANG XINGSHOU
CN12 patents
⚠️ This page may combine multiple inventors who share the name “PANG XINGSHOU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NXP USA INC
7 patentsUS10515880B2Dec 24, 2019
Lead frame with bendable leads
NXP USA INC5 citations72
US10037935B1Jul 31, 2018
Lead frame with dummy leads for burr mitigation during encapsulation
NXP USA INC6 citations71
US10446476B2Oct 15, 2019
Packaged integrated circuit having stacked die and method for therefor
NXP USA INC3 citations70
US11417541B2Aug 16, 2022
Protection from metal migration on IC packages
NXP USA INC0 citations62
US10181434B1Jan 15, 2019
Lead frame for integrated circuit device having J-leads and gull wing leads
NXP USA INC1 citations62
US11784112B2Oct 10, 2023
Integrated circuit package and method to manufacture the integrated circuit package to reduce bond wire defects in the integrated circuit package
NXP USA INC0 citations48
US10217700B1Feb 26, 2019
Lead frame for integrated circuit device having J-leads and Gull Wing leads
NXP USA INC0 citations41