Inventor
YAO JINZHONG
CN31 patents
⚠️ This page may combine multiple inventors who share the name “YAO JINZHONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NXP USA INC
9 patentsUS9890034B2Feb 13, 2018
Cavity type pressure sensor device
NXP USA INC2 citations73
US10515880B2Dec 24, 2019
Lead frame with bendable leads
NXP USA INC5 citations72
US10037935B1Jul 31, 2018
Lead frame with dummy leads for burr mitigation during encapsulation
NXP USA INC6 citations71
US10446476B2Oct 15, 2019
Packaged integrated circuit having stacked die and method for therefor
NXP USA INC3 citations70
US11417541B2Aug 16, 2022
Protection from metal migration on IC packages
NXP USA INC0 citations62
US10181434B1Jan 15, 2019
Lead frame for integrated circuit device having J-leads and gull wing leads
NXP USA INC1 citations62
US10290593B2May 14, 2019
Method of assembling QFP type semiconductor device
NXP USA INC0 citations52
US11784112B2Oct 10, 2023
Integrated circuit package and method to manufacture the integrated circuit package to reduce bond wire defects in the integrated circuit package
NXP USA INC0 citations48
US10217700B1Feb 26, 2019
Lead frame for integrated circuit device having J-leads and Gull Wing leads
NXP USA INC0 citations41
BAI ZHIGANG
6 patentsUS8859339B2Oct 14, 2014
Mold chase
BAI ZHIGANG7 citations84
US8525311B2Sep 3, 2013
Lead frame for semiconductor device
BAI ZHIGANG8 citations84
US8901721B1Dec 2, 2014
Lead frame based semiconductor die package
BAI ZHIGANG12 citations82
US9589928B2Mar 7, 2017
Combined QFN and QFP semiconductor package
BAI ZHIGANG4 citations73
US9214447B2Dec 15, 2015
Non-leaded type semiconductor package and method of assembling same
BAI ZHIGANG2 citations63
US9443746B2Sep 13, 2016
Floating mold tool for semicondcutor packaging
BAI ZHIGANG1 citations51
FREESCALE SEMICONDUCTOR INC
5 patentsUS9324637B1Apr 26, 2016
Quad flat non-leaded semiconductor package with wettable flank
FREESCALE SEMICONDUCTOR INC11 citations83
US9362211B1Jun 7, 2016
Exposed pad integrated circuit package with mold lock
FREESCALE SEMICONDUCTOR INC7 citations80
US9190351B2Nov 17, 2015
Semiconductor device with webbing between leads
FREESCALE SEMICONDUCTOR INC6 citations73
US7727817B2Jun 1, 2010
Semiconductor integrated circuit package and method of packaging semiconductor integrated circuit
FREESCALE SEMICONDUCTOR INC5 citations62
US8050048B2Nov 1, 2011
Lead frame with solder flow control
FREESCALE SEMICONDUCTOR INC2 citations59
YAO JINZHONG
4 patentsUS8716846B2May 6, 2014
Pressure sensor and method of packaging same
YAO JINZHONG4 citations71
US8802474B1Aug 12, 2014
Pressure sensor and method of packaging same
YAO JINZHONG2 citations61
US8709875B2Apr 29, 2014
Power device and method of packaging same
YAO JINZHONG2 citations61
US8202222B2Jun 19, 2012
Equal phase two-dimensional array probe
YAO JINZHONG1 citations44
LUO JUNHUA
4 patentsUS8481369B2Jul 9, 2013
Method of making semiconductor package with improved standoff
LUO JUNHUA0 citations47
US8722465B1May 13, 2014
Method of assembling semiconductor device including insulating substrate and heat sink
LUO JUNHUA0 citations46
US8643170B2Feb 4, 2014
Method of assembling semiconductor device including insulating substrate and heat sink
LUO JUNHUA0 citations46
US8859336B2Oct 14, 2014
Method of packaging semiconductor die with cap element
LUO JUNHUA0 citations38