Inventor · disambiguated record
Edmond O. Fey
Also filed as: FEY EDMOND O · FEY EDMOND OTTO
18 granted patents·218 citations·filing 1980–2004
95Inventor score
Files withIBM18
Top patents by PatentIndex Score
18 records- 0186US4444626AElectrochromic printingIBM·Filed 1983·Granted Apr 24, 1984·32 cites·24 claims
- 0285US6815126B2Printed wiring board with conformally plated circuit tracesIBM·Filed 2002·Granted Nov 9, 2004·30 cites·7 claims
- 0375US6586683B2Printed circuit board with mixed metallurgy pads and method of fabricationIBM·Filed 2001·Granted Jul 1, 2003·15 cites·15 claims
- 0464US4358479ATreatment of copper and use thereofIBM·Filed 1980·Granted Nov 9, 1982·20 cites·11 claims
- 0560US6931722B2Method of fabricating printed circuit board with mixed metallurgy padsIBM·Filed 2003·Granted Aug 23, 2005·7 cites·19 claims
- 0654US6607613B2Solder ball with chemically and mechanically enhanced surface propertiesIBM·Filed 2001·Granted Aug 19, 2003·5 cites·12 claims
- 0753US6056831AProcess for chemically and mechanically enhancing solder surface propertiesIBM·Filed 1998·Granted May 2, 2000·13 cites·19 claims
- 0851US6843929B1Accelerated etching of chromiumIBM·Filed 2000·Granted Jan 18, 2005·3 cites·20 claims
- 0951US5311660AMethyl chloroform-free desmear process in additive circuitizationIBM·Filed 1993·Granted May 17, 1994·17 cites·10 claims
- 1050US6046500AMethod of controlling the spread of an adhesive on a circuitized organic substrateIBM·Filed 1997·Granted Apr 4, 2000·15 cites·11 claims
- 1150US4684545AElectroless plating with bi-level control of dissolved oxygenIBM·Filed 1986·Granted Aug 4, 1987·14 cites·8 claims
- 1249US6063481AProcess for removal of undersirable conductive material on a circuitized substrate and resultant circuitized substrateIBM·Filed 1998·Granted May 16, 2000·12 cites·9 claims
- 1349US5910341AMethod of controlling the spread of an adhesive on a circuitized organic substrateIBM·Filed 1996·Granted Jun 8, 1999·14 cites·19 claims
- 1447US6335495B1Patterning a layered chrome-copper structure disposed on a dielectric substrateIBM·Filed 1999·Granted Jan 1, 2002·11 cites·10 claims
- 1544US7378227B2Method of making a printed wiring board with conformally plated circuit tracesIBM·Filed 2004·Granted May 27, 2008·0 cites·18 claims
- 1640US6544584B1Process for removal of undesirable conductive material on a circuitized substrate and resultant circuitized substrateIBM·Filed 1997·Granted Apr 8, 2003·7 cites·13 claims
- 1730US4967690AElectroless plating with bi-level control of dissolved oxygen, with specific location of chemical maintenance meansIBM·Filed 1990·Granted Nov 6, 1990·3 cites·2 claims
- 1829US6210547B1Enhanced solder surface and process for chemically and mechanically enhancing solder surface propertiesIBM·Filed 1999·Granted Apr 3, 2001·0 cites·18 claims
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