Inventor

VAN SCHRAVENDIJK BART

US70 patents

⚠️ This page may combine multiple inventors who share the name “VAN SCHRAVENDIJK BART”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

VAN SCHRAVENDIJK BART

NOVELLUS SYSTEMS INC

Protective self-aligned buffer layers for damascene interconnects

Very high aspect ratio gapfill using HDP

UV treatment for carbon-containing low-k dielectric repair in semiconductor processing

UV treatment of STI films for increasing tensile stress

Gap fill for high aspect ratio structures

Atomic layer removal for high aspect ratio gapfill

Interfacial layers for electromigration resistance improvement in damascene interconnects

Protection of Cu damascene interconnects by formation of a self-aligned buffer layer

Method for depositing a chlorine-free conformal sin film

Interfacial layers for electromigration resistance improvement in damascene interconnects

Plasma activated conformal dielectric film deposition

Plasma activated conformal dielectric film deposition

Conformal film deposition for gapfill

Method for depositing a chlorine-free conformal SiN film

Hardmask materials

Protection of Cu damascene interconnects by formation of a self-aligned buffer layer

Protective self-aligned buffer layers for damascene interconnects

Multistep method of depositing metal seed layers

Applications and methods of making nitrogen-free anti-reflective layers for semiconductor processing

Gap fill for high aspect ratio structures

LAM RES CORP

Inhibitor plasma mediated atomic layer deposition for seamless feature fill

Inhibitor plasma mediated atomic layer deposition for seamless feature fill

Air gap spacer integration for improved fin device performance

Method for forming a mask by etching conformal film on patterned ashable hardmask

Densification of dielectric film using inductively coupled high density plasma

ANTONELLI GEORGE ANDREW

PECVD flowable dielectric gap fill

Remote plasma processing of interface surfaces

Remote plasma processing of interface surfaces

CHATTOPADHYAY KAUSHIK

Methods for reducing UV and dielectric diffusion barrier interaction

Protective self-aligned buffer layers for damascene interconnects

Protective self-aligned buffer layers for damascene interconnects

DRAEGER NERISSA

Atomic layer removal process with higher etch amount

Flowable oxide film with tunable wet etch rate

VAN SCHRAVENDIJK BART

Protective layer to enable damage free gap fill

UV treatment of etch stop and hard mask films for selectivity and hermeticity enhancement

RANGARAJAN VISHWANATHAN

Hardmask materials

Hardmask materials

SWAMINATHAN SHANKAR

Conformal doping via plasma activated atomic layer deposition and conformal film deposition

DANEK MICHAL

Premetal dielectric integration process

HAUSMANN DENNIS

Method for depositing a chlorine-free conformal sin film

ROY SHAMBHU N

Dual plenum, axi-symmetric showerhead with edge-to-center gas delivery

ASHTIANI KAIHAN

Gap fill integration

NOVELLUS SYSTEMS

Process for depositing F-doped silica glass in high aspect ratio structures

FOX KEITH

Smooth silicon-containing films

HAVERKAMP JASON

In-situ deposition of film stacks

ROZBICKI ROBERT

Multistep method of depositing metal seed layers

WU HUI-JUNG

Reducing UV and dielectric diffusion barrier interaction through the modulation of optical properties

NOVELLIUS SYSTEMS INC

Method of improving adhesion between two dielectric films

WANG FENG

CVD flowable gap fill

VARADARAJAN BHADRI N

Carbon containing low-k dielectric constant recovery using UV treatment