Inventor
KIMURA YOSHIE
US20 patents
⚠️ This page may combine multiple inventors who share the name “KIMURA YOSHIE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
17 patentsUS9515156B2Dec 6, 2016
Air gap spacer integration for improved fin device performance
LAM RES CORP42 citations92
US11211253B2Dec 28, 2021
Atomic layer deposition and etch in a single plasma chamber for critical dimension control
LAM RES CORP8 citations82
US10734238B2Aug 4, 2020
Atomic layer deposition and etch in a single plasma chamber for critical dimension control
LAM RES CORP10 citations82
US8852964B2Oct 7, 2014
Controlling CD and CD uniformity with trim time and temperature on a wafer by wafer basis
LAM RES CORP14 citations82
US9633846B2Apr 25, 2017
Internal plasma grid applications for semiconductor fabrication
LAM RES CORP8 citations81
US9230819B2Jan 5, 2016
Internal plasma grid applications for semiconductor fabrication in context of ion-ion plasma processing
LAM RES CORP15 citations81
US10950454B2Mar 16, 2021
Integrated atomic layer passivation in TCP etch chamber and in-situ etch-ALP method
LAM RES CORP2 citations72
US9012243B2Apr 21, 2015
Controlling CD and CD uniformity with trim time and temperature on a wafer by wafer basis
LAM RES CORP4 citations71
US12125711B2Oct 22, 2024
Reducing roughness of extreme ultraviolet lithography resists
LAM RES CORP3 citations69
US10957561B2Mar 23, 2021
Gas delivery system
LAM RES CORP5 citations69
US10658174B2May 19, 2020
Atomic layer deposition and etch for reducing roughness
LAM RES CORP3 citations68
US10515815B2Dec 24, 2019
Atomic layer deposition and etch in a single plasma chamber for fin field effect transistor formation
LAM RES CORP4 citations67
US12573589B2Mar 10, 2026
Synchronization of RF generators
LAM RES CORP0 citations60
US12046450B2Jul 23, 2024
Synchronization of RF generators
LAM RES CORP0 citations60
US12217955B2Feb 4, 2025
Method for etching features using a targeted deposition for selective passivation
LAM RES CORP0 citations57
US11170997B2Nov 9, 2021
Atomic layer deposition and etch for reducing roughness
LAM RES CORP0 citations57
US9589853B2Mar 7, 2017
Method of planarizing an upper surface of a semiconductor substrate in a plasma etch chamber
LAM RES CORP0 citations41
FUJITSU LTD
2 patentsUS12367664B2Jul 22, 2025
Computer-readable recording medium storing label change program, label change method, and information processing apparatus
FUJITSU LTD0 citations51
US11428522B2Aug 30, 2022
Distance measuring device, distance measuring method, and non-transitory computer-readable storage medium for storing program
FUJITSU LTD0 citations51