P

Inventor

KIMURA YOSHIE

US20 patents
⚠️ This page may combine multiple inventors who share the name “KIMURA YOSHIE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LAM RES CORP

17 patents
US9515156B2Dec 6, 2016

Air gap spacer integration for improved fin device performance

LAM RES CORP42 citations92
US11211253B2Dec 28, 2021

Atomic layer deposition and etch in a single plasma chamber for critical dimension control

LAM RES CORP8 citations82
US10734238B2Aug 4, 2020

Atomic layer deposition and etch in a single plasma chamber for critical dimension control

LAM RES CORP10 citations82
US8852964B2Oct 7, 2014

Controlling CD and CD uniformity with trim time and temperature on a wafer by wafer basis

LAM RES CORP14 citations82
US9633846B2Apr 25, 2017

Internal plasma grid applications for semiconductor fabrication

LAM RES CORP8 citations81
US9230819B2Jan 5, 2016

Internal plasma grid applications for semiconductor fabrication in context of ion-ion plasma processing

LAM RES CORP15 citations81
US10950454B2Mar 16, 2021

Integrated atomic layer passivation in TCP etch chamber and in-situ etch-ALP method

LAM RES CORP2 citations72
US9012243B2Apr 21, 2015

Controlling CD and CD uniformity with trim time and temperature on a wafer by wafer basis

LAM RES CORP4 citations71
US12125711B2Oct 22, 2024

Reducing roughness of extreme ultraviolet lithography resists

LAM RES CORP3 citations69
US10957561B2Mar 23, 2021

Gas delivery system

LAM RES CORP5 citations69
US10658174B2May 19, 2020

Atomic layer deposition and etch for reducing roughness

LAM RES CORP3 citations68
US10515815B2Dec 24, 2019

Atomic layer deposition and etch in a single plasma chamber for fin field effect transistor formation

LAM RES CORP4 citations67
US12573589B2Mar 10, 2026

Synchronization of RF generators

LAM RES CORP0 citations60
US12046450B2Jul 23, 2024

Synchronization of RF generators

LAM RES CORP0 citations60
US12217955B2Feb 4, 2025

Method for etching features using a targeted deposition for selective passivation

LAM RES CORP0 citations57
US11170997B2Nov 9, 2021

Atomic layer deposition and etch for reducing roughness

LAM RES CORP0 citations57
US9589853B2Mar 7, 2017

Method of planarizing an upper surface of a semiconductor substrate in a plasma etch chamber

LAM RES CORP0 citations41

FUJITSU LTD

2 patents

ZHONG QINGHUA

1 patent