P

Inventor

KISTLER RODNEY

US20 patents

Patents

20 patents
US7010468B2Mar 7, 2006

Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detection

LAM RES CORP16 citations92
US6984892B2Jan 10, 2006

Semiconductor structure implementing low-K dielectric materials and supporting stubs

LAM RES CORP23 citations92
US6929531B2Aug 16, 2005

System and method for metal residue detection and mapping within a multi-step sequence

LAM RES CORP23 citations92
US6808590B1Oct 26, 2004

Method and apparatus of arrayed sensors for metrological control

LAM RES CORP31 citations92
US6579157B1Jun 17, 2003

Polishing pad ironing system and method for implementing the same

LAM RES CORP19 citations92
US7128803B2Oct 31, 2006

Integration of sensor based metrology into semiconductor processing tools

LAM RES CORP28 citations89
US6653224B1Nov 25, 2003

Methods for fabricating interconnect structures having Low K dielectric properties

LAM RES CORP26 citations89
US7309618B2Dec 18, 2007

Method and apparatus for real time metal film thickness measurement

LAM RES CORP10 citations84
US6540587B1Apr 1, 2003

Infrared end-point detection system

LAM RES CORP15 citations84
US7425501B2Sep 16, 2008

Semiconductor structure implementing sacrificial material and methods for making and implementing the same

LAM RES CORP5 citations74
US7084621B2Aug 1, 2006

Enhancement of eddy current based measurement capabilities

LAM RES CORP10 citations74
US6951624B2Oct 4, 2005

Method and apparatus of arrayed sensors for metrological control

LAM RES CORP5 citations74
US6859765B2Feb 22, 2005

Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detection

LAM RES CORP7 citations73
US6937915B1Aug 30, 2005

Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control

LAM RES CORP11 citations72
US6925348B2Aug 2, 2005

Methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control

LAM RES CORP9 citations72
US7205166B2Apr 17, 2007

Method and apparatus of arrayed, clustered or coupled eddy current sensor configuration for measuring conductive film properties

LAM RES CORP8 citations70
US7875548B2Jan 25, 2011

Method for making semiconductor structures implementing sacrificial material

LAM RES CORP1 citations63
US6922053B2Jul 26, 2005

Complementary sensors metrological process and method and apparatus for implementing the same

LAM RES CORP2 citations63
US6894491B2May 17, 2005

Method and apparatus for metrological process control implementing complementary sensors

LAM RES CORP4 citations63
US6896596B2May 24, 2005

Polishing pad ironing system

LAM RES CORP5 citations62