P

Inventor

SCHUPKE KRISTIN

DE11 patents
⚠️ This page may combine multiple inventors who share the name “SCHUPKE KRISTIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INFINEON TECHNOLOGIES AG

6 patents
US6734077B2May 11, 2004

Method for fabricating a trench capacitor for a semiconductor memory

INFINEON TECHNOLOGIES AG21 citations88
US6740595B2May 25, 2004

Etch process for recessing polysilicon in trench structures

INFINEON TECHNOLOGIES AG16 citations83
US7018781B2Mar 28, 2006

Method for fabricating a contact hole plane in a memory module

INFINEON TECHNOLOGIES AG9 citations69
US7005723B2Feb 28, 2006

Bipolar transistor and method of producing same

INFINEON TECHNOLOGIES AG6 citations62
US6821863B2Nov 23, 2004

Method for producing a cavity in a monocrystalline silicon substrate and a semiconductor component having a cavity in a monocrystalline silicon substrate with an epitaxial covering layer

INFINEON TECHNOLOGIES AG2 citations58
US7479461B2Jan 20, 2009

Method of etching silicon anisotropically

INFINEON TECHNOLOGIES AG1 citations45

QIMONDA AG

2 patents
US7863149B2Jan 4, 2011

Method for fabricating a capacitor

QIMONDA AG3 citations61
US7615444B2Nov 10, 2009

Method for forming a capacitor structure

QIMONDA AG4 citations61

NANYA TECHNOLOGY CORP

1 patent
US7078748B2Jul 18, 2006

Multi-layer gate stack structure comprising a metal layer for a FET device, and method for fabricating the same

NANYA TECHNOLOGY CORP9 citations71

KUMARASAMY SIVAKUMAR

1 patent
US8835298B2Sep 16, 2014

NiSi rework procedure to remove platinum residuals

KUMARASAMY SIVAKUMAR0 citations41

FITZ CLEMENS

1 patent
US8835318B2Sep 16, 2014

HNO3 single wafer clean process to strip nickel and for MOL post etch

FITZ CLEMENS0 citations40