Inventor

MANCERA RAUL

US4 patents

⚠️ This page may combine multiple inventors who share the name “MANCERA RAUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

3 patents

US7882628B2Feb 8, 2011

Multi-chip packaging using an interposer such as a silicon based interposer with through-silicon-vias

INTEL CORP13 citations83

US7841080B2Nov 30, 2010

Multi-chip packaging using an interposer with through-vias

INTEL CORP10 citations83

US7576434B2Aug 18, 2009

Wafer-level solder bumps

INTEL CORP11 citations79

MUTHUKUMAR SRIRAM

1 patent

US8387240B2Mar 5, 2013

Methods for making multi-chip packaging using an interposer

MUTHUKUMAR SRIRAM1 citations50