Inventor

HWANG CHI-WON

JP25 patents

⚠️ This page may combine multiple inventors who share the name “HWANG CHI-WON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HWANG CHI-WON

SAMSUNG ELECTRO MECH

Printed circuit board and method of manufacturing the same

Printed circuit board

Printed circuit board and electronic component package including the same

Connection structure embedded substrate and substrate structure including the same

Printed circuit board and method for manufacturing the same

Printed circuit board

Printed circuit board and electronic component package including the same

Printed circuit board and method of manufacturing the same

Connection structure embedded substrate and substrate structure including the same

Printed circuit board

Printed circuit board

Printed circuit board

Printed circuit board

Conductive ball mounting device

INTEL CORP

Sintered metallic thermal interface materials for microelectronic cooling assemblies

Horizontal Carbon Nanotubes by Vertical Growth and Rolling

Multi-chip packaging using an interposer such as a silicon based interposer with through-silicon-vias

Multi-chip packaging using an interposer with through-vias

Method of assembling carbon nanotube reinforced solder caps

Carbon nanotube reinforced metallic layer

Methods of forming C4 round dimple metal stud bumps for fine pitch packaging applications and structures formed thereby

IAC IN NAT UNIV CHUNGNAM

Method for manufacturing adsorptive ball for recovering precious metals and flow through-continuous deionization (FT-CDI) apparatus using the same

Electrolytic cell for flow through-continuous deionization

HWANG CHI-WON

Carbon nanotube-reinforced solder caps, and chip packages and systems containing same

MUTHUKUMAR SRIRAM

Methods for making multi-chip packaging using an interposer