Inventor
REICHENBACH FRANK
DE22 patents
⚠️ This page may combine multiple inventors who share the name “REICHENBACH FRANK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
BOSCH GMBH ROBERT
15 patentsUS6936902B2Aug 30, 2005
Sensor with at least one micromechanical structure and method for production thereof
BOSCH GMBH ROBERT34 citations91
US7834409B2Nov 16, 2010
Micromechanical component and corresponding method for its manufacture
BOSCH GMBH ROBERT14 citations83
US6955975B2Oct 18, 2005
Method for joining a silicon plate to a second plate
BOSCH GMBH ROBERT7 citations73
US7273764B2Sep 25, 2007
Sensor with at least one micromechanical structure, and method for producing it
BOSCH GMBH ROBERT6 citations72
US10556789B2Feb 11, 2020
Laser resealing with stress-reducing prestructuring
BOSCH GMBH ROBERT2 citations71
US10029911B2Jul 24, 2018
Micromechanical component including a diffusion stop channel
BOSCH GMBH ROBERT4 citations71
US9890035B2Feb 13, 2018
Method for manufacturing a micromechanical component
BOSCH GMBH ROBERT4 citations71
US10017375B2Jul 10, 2018
Structures for reducing and preventing stress and tensions during processing of silicon with the aid of melting by a laser
BOSCH GMBH ROBERT2 citations69
US7564033B2Jul 21, 2009
Microstructured sensor
BOSCH GMBH ROBERT2 citations61
US10023460B2Jul 17, 2018
Structures for reducing and avoiding stresses on the seal bottom side during laser reseal
BOSCH GMBH ROBERT1 citations50
US7495328B2Feb 24, 2009
Micromechanical component
BOSCH GMBH ROBERT0 citations45
US12404170B2Sep 2, 2025
Method for producing a bonding pad for a micromechanical sensor element
BOSCH GMBH ROBERT0 citations44
US10000375B2Jun 19, 2018
Structures and process for preventing a projection of the laser resealing structure beyond the wafer surface
BOSCH GMBH ROBERT0 citations40
US10183861B2Jan 22, 2019
Laser reseal including a protective structure
BOSCH GMBH ROBERT0 citations39
US9927497B2Mar 27, 2018
Sensor apparatus, production method for a sensor apparatus having at least one magnetic core and method for determining a field strength of a magnetic field in at least one spatial direction
BOSCH GMBH ROBERT0 citations34
REICHENBACH FRANK
4 patentsUS8698255B2Apr 15, 2014
Semiconductor component having a micromechanical microphone structure
REICHENBACH FRANK8 citations82
US8637945B2Jan 28, 2014
Component having a micromechanical microphone structure, and method for its production
REICHENBACH FRANK10 citations81
US8329555B2Dec 11, 2012
Method for producing a capping wafer for a sensor
REICHENBACH FRANK6 citations71
US8963777B2Feb 24, 2015
Method and node for localizing a node in a wireless network
REICHENBACH FRANK0 citations36