Inventor
SONG BYEUNG SOO
KR5 patents
Patents
5 patentsUS10910270B2Feb 2, 2021
Method of forming and packaging semiconductor die
MAGNACHIP SEMICONDUCTOR LTD6 citations66
US11901322B2Feb 13, 2024
Fabrication method of semiconductor die and chip-on-plastic packaging of semiconductor die
MAGNACHIP SEMICONDUCTOR LTD0 citations59
US11380640B2Jul 5, 2022
Fabrication method of semiconductor die and chip-on-plastic packaging of semiconductor die
MAGNACHIP SEMICONDUCTOR LTD0 citations59
US10741521B2Aug 11, 2020
Semiconductor package and method of manufacturing semiconductor package
MAGNACHIP SEMICONDUCTOR LTD0 citations50
US12456651B2Oct 28, 2025
Semiconductor die forming and packaging method using ultrashort pulse laser micromachining
MAGNACHIP SEMICONDUCTOR LTD0 citations49