Inventor
LI KUO-LUNG
TW16 patents
⚠️ This page may combine multiple inventors who share the name “LI KUO-LUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
12 patentsUS10199385B1Feb 5, 2019
Non-volatile memory device with reduced distance between control gate electrode and selecting gate electrode and manufacturing method thereof
UNITED MICROELECTRONICS CORP2 citations71
US10340282B1Jul 2, 2019
Semiconductor memory device and fabrication method thereof
UNITED MICROELECTRONICS CORP2 citations70
US11600709B2Mar 7, 2023
Memory cell and fabricating method of the same
UNITED MICROELECTRONICS CORP0 citations59
US11417742B1Aug 16, 2022
Memory cell and fabricating method of the same
UNITED MICROELECTRONICS CORP0 citations59
US9129852B1Sep 8, 2015
Method for fabricating non-volatile memory semiconductor device
UNITED MICROELECTRONICS CORP3 citations59
US11374109B2Jun 28, 2022
Method for fabricating gate structures
UNITED MICROELECTRONICS CORP0 citations49
US10720440B2Jul 21, 2020
Method for fabricating semiconductor structure
UNITED MICROELECTRONICS CORP0 citations49
US9966382B2May 8, 2018
Semiconductor structure and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations49
US11362186B2Jun 14, 2022
Non-volatile memory device and method for manufacturing the same
UNITED MICROELECTRONICS CORP0 citations48
US10580780B2Mar 3, 2020
Semiconductor structure and method of forming the same
UNITED MICROELECTRONICS CORP0 citations47
US9412851B2Aug 9, 2016
Method for fabricating semiconductor device including a patterned multi-layered dielectric film with an exposed edge
UNITED MICROELECTRONICS CORP0 citations47
US9466497B1Oct 11, 2016
Method for fabricating a silicon-oxide-nitride-oxide-silicon (SONOS) non-volatile memory cell
UNITED MICROELECTRONICS CORP0 citations40
TAIWAN SEMICONDUCTOR MFG CO LTD
3 patentsUS9425313B1Aug 23, 2016
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD14 citations83
US10170429B2Jan 1, 2019
Method for forming package structure including intermetallic compound
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations70
US9691903B2Jun 27, 2017
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51