Inventor
KO YUAN-FU
TW8 patents
Patents
8 patentsUS10204826B1Feb 12, 2019
Method for removing damaged layer embedded in a dielectric layer
UNITED MICROELECTRONICS CORP20 citations91
US12057346B2Aug 6, 2024
Semiconductor device including metal interconnections having sidewall spacers thereon, and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations61
US11791203B2Oct 17, 2023
Semiconductor device including metal interconnections having sidewall spacers thereon, and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations61
US11515159B2Nov 29, 2022
Forming contact holes using litho-etch-litho-etch approach
UNITED MICROELECTRONICS CORP0 citations61
US11456207B2Sep 27, 2022
Semiconductor device including metal interconnections having sidewall spacers thereon, and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations61
US10916427B2Feb 9, 2021
Forming contact holes using litho-etch-litho-etch approach
UNITED MICROELECTRONICS CORP1 citations61
US12007435B2Jun 11, 2024
Method of copper hillock detecting
UNITED MICROELECTRONICS CORP0 citations51
US12334436B2Jun 17, 2025
Metal interconnect structure having serpent metal line
UNITED MICROELECTRONICS CORP0 citations50