Inventor
HINAGA SCOTT
US6 patents
Patents
6 patentsUS11202368B2Dec 14, 2021
Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane
CISCO TECH INC1 citations71
US12289831B2Apr 29, 2025
Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane
CISCO TECH INC0 citations60
US11706870B2Jul 18, 2023
Providing one or more carbon layers to a copper conductive material to reduce power loss in a power plane
CISCO TECH INC0 citations60
US12160948B2Dec 3, 2024
Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board
CISCO TECH INC0 citations59
US11751322B2Sep 5, 2023
Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board
CISCO TECH INC0 citations59
US11330702B2May 10, 2022
Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board
CISCO TECH INC0 citations59