Inventor
ROEMER MADELINE MARIE
US4 patents
Patents
4 patentsUS12074081B2Aug 27, 2024
Use of bimetals in a heat sink to benefit heat transfer from high temperature integrated circuit components on a circuit board
CISCO TECH INC3 citations69
US12160948B2Dec 3, 2024
Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board
CISCO TECH INC0 citations59
US11751322B2Sep 5, 2023
Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board
CISCO TECH INC0 citations59
US11330702B2May 10, 2022
Integrating graphene into the skin depth region of high speed communications signals for a printed circuit board
CISCO TECH INC0 citations59