Inventor
TAKEDA NOBORU
JP33 patents
⚠️ This page may combine multiple inventors who share the name “TAKEDA NOBORU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DISCO CORP
28 patentsUS9209591B2Dec 8, 2015
Laser processing method
DISCO CORP10 citations84
US7557904B2Jul 7, 2009
Wafer holding mechanism
DISCO CORP12 citations83
US7446022B2Nov 4, 2008
Wafer laser processing method
DISCO CORP15 citations83
US10119921B2Nov 6, 2018
Internal crack detecting method and internal crack detecting apparatus
DISCO CORP3 citations73
US10071442B2Sep 11, 2018
Laser processing apparatus
DISCO CORP3 citations73
US9812362B2Nov 7, 2017
Wafer processing method
DISCO CORP3 citations73
US9537046B2Jan 3, 2017
Optical device wafer processing method
DISCO CORP4 citations73
US9349646B2May 24, 2016
Wafer processing method including a filament forming step and an etching step
DISCO CORP5 citations73
US9761492B2Sep 12, 2017
Processing method of optical device wafer
DISCO CORP3 citations71
US9517962B2Dec 13, 2016
Plate-shaped object processing method
DISCO CORP3 citations70
US9305793B2Apr 5, 2016
Wafer processing method
DISCO CORP2 citations63
US9117895B2Aug 25, 2015
Laser processing method
DISCO CORP3 citations63
US7642485B2Jan 5, 2010
Laser beam processing machine
DISCO CORP2 citations62
US11597040B2Mar 7, 2023
Laser processing apparatus
DISCO CORP0 citations52
US10923398B2Feb 16, 2021
Wafer processing method
DISCO CORP0 citations52
US10780524B2Sep 22, 2020
Laser processing method and laser processing apparatus
DISCO CORP0 citations52
US7582541B2Sep 1, 2009
Wafer laser processing method
DISCO CORP1 citations52
US12134577B2Nov 5, 2024
Manufacturing method of plate-shaped object
DISCO CORP0 citations44
US10628933B2Apr 21, 2020
Inspecting apparatus and laser processing apparatus
DISCO CORP0 citations42
US10553490B2Feb 4, 2020
Processing method for wafer
DISCO CORP0 citations42
US9682440B2Jun 20, 2017
Chip manufacturing method
DISCO CORP0 citations42
US12194571B2Jan 14, 2025
Wafer forming method
DISCO CORP0 citations41
US9793166B2Oct 17, 2017
Lift-off method
DISCO CORP0 citations41
US10157793B2Dec 18, 2018
Method of processing single-crystal substrate
DISCO CORP0 citations40
US10103061B2Oct 16, 2018
Processing method of single-crystal substrate
DISCO CORP0 citations40
US9735040B2Aug 15, 2017
Method of processing single-crystal substrate
DISCO CORP0 citations40
US9887140B2Feb 6, 2018
Wafer processing method
DISCO CORP0 citations39
US10809201B2Oct 20, 2020
Crystal orientation detecting apparatus and crystal orientation detecting method
DISCO CORP0 citations31