Inventor
MORIKAZU HIROSHI
JP96 patents
⚠️ This page may combine multiple inventors who share the name “MORIKAZU HIROSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DISCO CORP
40 patentsUS7473866B2Jan 6, 2009
Laser processing apparatus
DISCO CORP124 citations96
US9209591B2Dec 8, 2015
Laser processing method
DISCO CORP10 citations84
US9174305B2Nov 3, 2015
Laser processing apparatus including plasma detecting means
DISCO CORP14 citations84
US9095931B2Aug 4, 2015
Laser processing method and laser processing apparatus
DISCO CORP7 citations84
US7919395B2Apr 5, 2011
Method for separating wafer using two laser beams
DISCO CORP8 citations84
US7675002B2Mar 9, 2010
Laser beam processing machine
DISCO CORP8 citations84
US7601616B2Oct 13, 2009
Wafer laser processing method
DISCO CORP15 citations84
US7557904B2Jul 7, 2009
Wafer holding mechanism
DISCO CORP12 citations83
US7471384B2Dec 30, 2008
Via hole depth detector
DISCO CORP15 citations83
US9576835B2Feb 21, 2017
Workpiece processing method
DISCO CORP8 citations82
US7754582B2Jul 13, 2010
Laser processing method
DISCO CORP9 citations82
US7569840B2Aug 4, 2009
Alignment method of a laser beam processing machine
DISCO CORP10 citations77
US10119921B2Nov 6, 2018
Internal crack detecting method and internal crack detecting apparatus
DISCO CORP3 citations73
US10071442B2Sep 11, 2018
Laser processing apparatus
DISCO CORP3 citations73
US9812362B2Nov 7, 2017
Wafer processing method
DISCO CORP3 citations73
US9656347B2May 23, 2017
Laser processing method for forming a laser processed hole in a work piece
DISCO CORP3 citations73
US9543466B2Jan 10, 2017
Method for forming shield tunnels in single-crystal substrates
DISCO CORP3 citations73
US9537046B2Jan 3, 2017
Optical device wafer processing method
DISCO CORP4 citations73
US9349646B2May 24, 2016
Wafer processing method including a filament forming step and an etching step
DISCO CORP5 citations73
US10319593B2Jun 11, 2019
Wafer thinning method
DISCO CORP6 citations72
US7408129B2Aug 5, 2008
Laser beam machine with cylindrical lens system
DISCO CORP8 citations72
US10910511B2Feb 2, 2021
Manufacturing method of III-V compound crystal and manufacturing method of semiconductor device
DISCO CORP2 citations71
US9613795B2Apr 4, 2017
Wafer processing method to remove crystal strains
DISCO CORP3 citations70
US9517962B2Dec 13, 2016
Plate-shaped object processing method
DISCO CORP3 citations70
US11211296B2Dec 28, 2021
Comparing method and laser processing apparatus
DISCO CORP2 citations68
US9536786B2Jan 3, 2017
Wafer processing method using pulsed laser beam to form shield tunnels along division lines of a semiconductor wafer
DISCO CORP4 citations68
US10483149B2Nov 19, 2019
Wafer processing method for dividing a wafer, including a shield tunnel forming step
DISCO CORP1 citations63
US9305793B2Apr 5, 2016
Wafer processing method
DISCO CORP2 citations63
US9233433B2Jan 12, 2016
Laser processing method and laser processing apparatus
DISCO CORP2 citations63
US9117895B2Aug 25, 2015
Laser processing method
DISCO CORP3 citations63
US9044819B2Jun 2, 2015
Laser processing apparatus
DISCO CORP2 citations63
US7932478B2Apr 26, 2011
Laser processing machine
DISCO CORP2 citations63
US7919725B2Apr 5, 2011
Via hole forming method
DISCO CORP2 citations63
US7767550B2Aug 3, 2010
Wafer laser processing method and laser processing equipment
DISCO CORP2 citations63
US7629229B2Dec 8, 2009
Laser processing method
DISCO CORP4 citations63
US7618892B2Nov 17, 2009
Via hole forming method
DISCO CORP2 citations63
US7589332B2Sep 15, 2009
Via-hole processing method
DISCO CORP4 citations63
US7355157B2Apr 8, 2008
Laser beam processing machine employing two beam spots having arcuate portions for forming a substantially rectangular combined spot
DISCO CORP5 citations63
US8049133B2Nov 1, 2011
Laser beam machining apparatus
DISCO CORP6 citations62
US7732729B2Jun 8, 2010
Laser processing device
DISCO CORP4 citations62
MORIKAZU HIROSHI
7 patentsUS9193008B2Nov 24, 2015
Laser processing method and laser processing apparatus
MORIKAZU HIROSHI14 citations84
US8518803B2Aug 27, 2013
Laser processing method for semiconductor wafer
MORIKAZU HIROSHI5 citations73
US8258428B2Sep 4, 2012
Laser beam processing machine
MORIKAZU HIROSHI6 citations73
US8513566B2Aug 20, 2013
Laser beam processing machine
MORIKAZU HIROSHI2 citations63
US8314014B2Nov 20, 2012
Laser processing apparatus and laser processing method
MORIKAZU HIROSHI5 citations63
US8258045B2Sep 4, 2012
Device processing method
MORIKAZU HIROSHI2 citations62
US8252667B2Aug 28, 2012
Laser processing method for semiconductor wafer
MORIKAZU HIROSHI2 citations62
KOYANAGI TASUKU
1 patentNOMARU KEIJI
1 patentOBA RYUGO
1 patentShowing the top 50 of 96 patents by PatentIndex Score.