Inventor
BUSBY JAMES A
US46 patents
⚠️ This page may combine multiple inventors who share the name “BUSBY JAMES A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
45 patentsUS9661747B1May 23, 2017
Tamper-respondent assemblies with enclosure-to-board protection
IBM43 citations98
US9554477B1Jan 24, 2017
Tamper-respondent assemblies with enclosure-to-board protection
IBM48 citations98
US9877383B2Jan 23, 2018
Tamper-respondent assemblies with enclosure-to-board protection
IBM17 citations94
US10306753B1May 28, 2019
Enclosure-to-board interface with tamper-detect circuit(s)
IBM16 citations93
US9881880B2Jan 30, 2018
Tamper-proof electronic packages with stressed glass component substrate(s)
IBM15 citations93
US9916744B2Mar 13, 2018
Multi-layer stack with embedded tamper-detect protection
IBM13 citations92
US9913362B2Mar 6, 2018
Tamper-respondent assemblies with bond protection
IBM13 citations92
US9894749B2Feb 13, 2018
Tamper-respondent assemblies with bond protection
IBM15 citations92
US7709951B2May 4, 2010
Thermal pillow
IBM27 citations92
US10217336B2Feb 26, 2019
Multi-layer stack with embedded tamper-detect protection
IBM5 citations84
US10177102B2Jan 8, 2019
Tamper-proof electronic packages with stressed glass component substrate(s)
IBM4 citations84
US10169967B1Jan 1, 2019
Multi-layer stack with embedded tamper-detect protection
IBM4 citations84
US10172232B2Jan 1, 2019
Tamper-respondent assemblies with enclosure-to-board protection
IBM4 citations84
US10169968B1Jan 1, 2019
Multi-layer stack with embedded tamper-detect protection
IBM4 citations84
US10143090B2Nov 27, 2018
Circuit layouts of tamper-respondent sensors
IBM6 citations84
US10136519B2Nov 20, 2018
Circuit layouts of tamper-respondent sensors
IBM6 citations84
US10115275B2Oct 30, 2018
Multi-layer stack with embedded tamper-detect protection
IBM4 citations84
US9999124B2Jun 12, 2018
Tamper-respondent assemblies with trace regions of increased susceptibility to breaking
IBM15 citations84
US9936573B2Apr 3, 2018
Tamper-respondent assemblies
IBM13 citations84
US9924591B2Mar 20, 2018
Tamper-respondent assemblies
IBM13 citations84
US9913370B2Mar 6, 2018
Tamper-proof electronic packages formed with stressed glass
IBM14 citations84
US9858776B1Jan 2, 2018
Tamper-respondent assembly with nonlinearity monitoring
IBM14 citations84
US7795724B2Sep 14, 2010
Sandwiched organic LGA structure
IBM16 citations84
US6848914B2Feb 1, 2005
Electrical coupling of substrates by conductive buttons
IBM13 citations84
US10334722B2Jun 25, 2019
Tamper-respondent assemblies
IBM2 citations73
US10327329B2Jun 18, 2019
Tamper-respondent assembly with flexible tamper-detect sensor(s) overlying in-situ-formed tamper-detect sensor
IBM4 citations73
US10264665B2Apr 16, 2019
Tamper-respondent assemblies with bond protection
IBM1 citations73
US10257924B2Apr 9, 2019
Tamper-proof electronic packages formed with stressed glass
IBM3 citations73
US10242543B2Mar 26, 2019
Tamper-respondent assembly with nonlinearity monitoring
IBM3 citations73
US7137826B2Nov 21, 2006
Temperature dependent semiconductor module connectors
IBM8 citations73
US7128579B1Oct 31, 2006
Hook interconnect
IBM7 citations73
US10531561B2Jan 7, 2020
Enclosure-to-board interface with tamper-detect circuit(s)
IBM3 citations72
US10595401B1Mar 17, 2020
Tamper detection at enclosure-to-board interface
IBM5 citations71
US6212077B1Apr 3, 2001
Built-in inspection template for a printed circuit
IBM6 citations68
US11147158B2Oct 12, 2021
Tamper-respondent assembly with interconnect characteristic(s) obscuring circuit layout
IBM0 citations63
US11122682B2Sep 14, 2021
Tamper-respondent sensors with liquid crystal polymer layers
IBM1 citations62
US11083082B2Aug 3, 2021
Enclosure-to-board interface with tamper-detect circuit(s)
IBM1 citations61
US6514777B2Feb 4, 2003
Built-in inspection template for a printed circuit
IBM2 citations57
US10624202B2Apr 14, 2020
Tamper-respondent assemblies with bond protection
IBM0 citations52
US10575398B2Feb 25, 2020
Tamper-respondent assembly with interconnect characteristic(s) obscuring circuit layout
IBM0 citations52
US10568202B2Feb 18, 2020
Tamper-respondent assembly with interconnect characteristic(s) obscuring circuit layout
IBM0 citations52
US10535618B2Jan 14, 2020
Tamper-proof electronic packages with stressed glass component substrate(s)
IBM0 citations52
US10535619B2Jan 14, 2020
Tamper-proof electronic packages with stressed glass component substrate(s)
IBM0 citations52
US7255571B2Aug 14, 2007
Temperature dependent semiconductor module connectors
IBM1 citations52
US10798816B1Oct 6, 2020
Tamper detection at enclosure-to-board interface
IBM0 citations50