Inventor

GAYNES MICHAEL A

US114 patents

⚠️ This page may combine multiple inventors who share the name “GAYNES MICHAEL A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GAYNES MICHAEL A

IBM

Method and device for semiconductor testing using electrically conductive adhesives

Thermally enhanced and mechanically balanced flip chip package and method of forming

Thermoplastic adhesive preform for heat sink attachment

Thermally enhanced and mechanically balanced flip chip package and method of forming

Method for bonding heat sinks to overmolds and device formed thereby

Process for fabrication of a selectively filled flexible adhesive device for solderless connection of electronic modules to a substrate

Direct chip attachment (DCA) with electrically conductive adhesives

Semiconductor chip carrier assembly

Stiffeners with improved adhesion to flexible substrates

Manufacturing flexible circuit board assemblies and printer for screening solder paste in such manufacture

Direct chip attachment (DCA) with electrically conductive adhesives

Manufacturing flexible circuit board assemblies with common heat spreaders

Pressurized injection nozzle for screening paste

Circuit board having a defined volume of solder or conductive adhesive deposited at interconnection sites for electrical circuits

Method for applying bonding agents to pad and/or interconnection sites in the manufacture of electrical circuits using a bonding agent injection head

Module with adhesively attached heat sink

Structure for removably attaching a heat sink to surface mount packages

Tamper-proof electronic packages with stressed glass component substrate(s)

Selectively filled adhesives for compliant, reworkable, and solder-free flip chip interconnection and encapsulation

Fluidic cooling systems and methods for electronic components

Thermoplastic adhesive preform for heat sink attachment

Common heatsink for multiple chips and modules

Semiconductor testing using electrically conductive adhesives

Polymer with transient liquid phase bondable particles

TFT panel alignment and attachment method and apparatus

Bonding together surfaces

TFT panel alignment and attachment method and apparatus

Polymer with transient liquid phase bondable particles

Dendrite interconnect for planarization and method for producing same

Wire mesh insert for thermal adhesives

Stabilization of conductive adhesive by metallurgical bonding

Electronic package assembly

Flexible circuit board and common heat spreader assembly

Organic-metallic composite coating for copper surface protection

Tamper-proof electronic packages with stressed glass component substrate(s)

Tamper-respondent assemblies with trace regions of increased susceptibility to breaking

Tamper-proof electronic packages formed with stressed glass

Process for measuring heat spreader tilt

Pressurized underfill cure

Process for measuring bond-line thickness

Thin, flexible microsystem with integrated energy source

Module with adhesively attached heat sink

Conductor interconnect with dendrites through film and method for producing same

Wire mesh insert for thermal adhesives

CHAINER TIMOTHY J

Cooled electronic system with thermal spreaders coupling electronics cards to cold rails

Method of fabricating a cooled electronic system

Using in situ capacitance measurements to monitor the stability of interface materials in complex PCB assemblies and other structures

COLGAN EVAN G

Semiconductor device cooling module

FEGER CLAUDIUS

No flow underfill or wafer level underfill and solder columns

GAYNES MICHAEL A

Flip chip bonder head for forming a uniform fillet