P

Inventor

SANTIAGO-FERNANDEZ WILLIAM

US57 patents

Patents

50 patents
US9661747B1May 23, 2017

Tamper-respondent assemblies with enclosure-to-board protection

IBM43 citations98
US9554477B1Jan 24, 2017

Tamper-respondent assemblies with enclosure-to-board protection

IBM48 citations98
US9877383B2Jan 23, 2018

Tamper-respondent assemblies with enclosure-to-board protection

IBM17 citations94
US9717154B2Jul 25, 2017

Enclosure with inner tamper-respondent sensor(s)

IBM34 citations94
US9591776B1Mar 7, 2017

Enclosure with inner tamper-respondent sensor(s)

IBM39 citations94
US10306753B1May 28, 2019

Enclosure-to-board interface with tamper-detect circuit(s)

IBM16 citations93
US9881880B2Jan 30, 2018

Tamper-proof electronic packages with stressed glass component substrate(s)

IBM15 citations93
US9916744B2Mar 13, 2018

Multi-layer stack with embedded tamper-detect protection

IBM13 citations92
US9913362B2Mar 6, 2018

Tamper-respondent assemblies with bond protection

IBM13 citations92
US9894749B2Feb 13, 2018

Tamper-respondent assemblies with bond protection

IBM15 citations92
US10321589B2Jun 11, 2019

Tamper-respondent assembly with sensor connection adapter

IBM7 citations84
US10299372B2May 21, 2019

Vented tamper-respondent assemblies

IBM6 citations84
US10217336B2Feb 26, 2019

Multi-layer stack with embedded tamper-detect protection

IBM5 citations84
US10175064B2Jan 8, 2019

Circuit boards and electronic packages with embedded tamper-respondent sensor

IBM4 citations84
US10177102B2Jan 8, 2019

Tamper-proof electronic packages with stressed glass component substrate(s)

IBM4 citations84
US10169968B1Jan 1, 2019

Multi-layer stack with embedded tamper-detect protection

IBM4 citations84
US10169967B1Jan 1, 2019

Multi-layer stack with embedded tamper-detect protection

IBM4 citations84
US10168185B2Jan 1, 2019

Circuit boards and electronic packages with embedded tamper-respondent sensor

IBM10 citations84
US10172232B2Jan 1, 2019

Tamper-respondent assemblies with enclosure-to-board protection

IBM4 citations84
US10115275B2Oct 30, 2018

Multi-layer stack with embedded tamper-detect protection

IBM4 citations84
US9913370B2Mar 6, 2018

Tamper-proof electronic packages formed with stressed glass

IBM14 citations84
US10378924B2Aug 13, 2019

Circuit boards and electronic packages with embedded tamper-respondent sensor

IBM2 citations73
US10378925B2Aug 13, 2019

Circuit boards and electronic packages with embedded tamper-respondent sensor

IBM3 citations73
US10271424B2Apr 23, 2019

Tamper-respondent assemblies with in situ vent structure(s)

IBM3 citations73
US10264665B2Apr 16, 2019

Tamper-respondent assemblies with bond protection

IBM1 citations73
US10257924B2Apr 9, 2019

Tamper-proof electronic packages formed with stressed glass

IBM3 citations73
US10102165B2Oct 16, 2018

Arbitration in an SRIOV environment

IBM3 citations73
US11244079B2Feb 8, 2022

Data detection mitigation in printed circuit boards

IBM2 citations72
US10531561B2Jan 7, 2020

Enclosure-to-board interface with tamper-detect circuit(s)

IBM3 citations72
US11822707B2Nov 21, 2023

Secure ventilation through protective flexible sensors

IBM0 citations62
US11122682B2Sep 14, 2021

Tamper-respondent sensors with liquid crystal polymer layers

IBM1 citations62
US10956623B2Mar 23, 2021

Enclosure with tamper respondent sensor

IBM1 citations62
US10915463B2Feb 9, 2021

Synchronizing requests to access computing resources

IBM0 citations62
US10496851B1Dec 3, 2019

Secure signal integrity

IBM1 citations62
US10426037B2Sep 24, 2019

Circuitized structure with 3-dimensional configuration

IBM1 citations62
US11991277B2May 21, 2024

Cryptographic hardware security module with secure embedded heat pipe

IBM0 citations61
US11882645B2Jan 23, 2024

Multi chip hardware security module

IBM0 citations61
US11382210B1Jul 5, 2022

Dielectric material change to optimize electrical and mechanical properties of flex circuit

IBM0 citations61
US11083082B2Aug 3, 2021

Enclosure-to-board interface with tamper-detect circuit(s)

IBM1 citations61
US12414229B2Sep 9, 2025

Tearing security feature of printed circuit substrates

IBM0 citations57
US11228457B2Jan 18, 2022

Priority-arbitrated access to a set of one or more computational engines

IBM0 citations52
US11191154B2Nov 30, 2021

Enclosure with tamper respondent sensor

IBM0 citations52
US10896140B2Jan 19, 2021

Controlling operation of multiple computational engines

IBM0 citations52
US10762243B1Sep 1, 2020

Secure signal integrity

IBM0 citations52
US10719454B2Jul 21, 2020

Synchronizing requests to access computing resources

IBM0 citations52
US10667389B2May 26, 2020

Vented tamper-respondent assemblies

IBM0 citations52
US10624202B2Apr 14, 2020

Tamper-respondent assemblies with bond protection

IBM0 citations52
US10586056B2Mar 10, 2020

Synchronizing write operations

IBM0 citations52
US10535618B2Jan 14, 2020

Tamper-proof electronic packages with stressed glass component substrate(s)

IBM0 citations52
US10535619B2Jan 14, 2020

Tamper-proof electronic packages with stressed glass component substrate(s)

IBM0 citations52

Showing the top 50 of 57 patents by PatentIndex Score.