Inventor
CHIANG LIAN-CHERNG
TW4 patents
Patents
4 patentsUS6307257B1Oct 23, 2001
Dual-chip integrated circuit package with a chip-die pad formed from leadframe leads
SILICONWARE PRECISION INDUSTRIES CO LTD96 citations97
US6753206B2Jun 22, 2004
Dual-chip integrated circuit package with unaligned chip arrangement and method of manufacturing the same
SILICONWARE PRECISION INDUSTRIES CO LTD24 citations92
US6498391B1Dec 24, 2002
Dual-chip integrated circuit package with unaligned chip arrangement and method of manufacturing the same
SILICONWARE PRECISION INDUSTRIES CO LTD18 citations92
US6590279B1Jul 8, 2003
Dual-chip integrated circuit package and method of manufacturing the same
SILICONWARE PRECISION INDUSTRIES CO LTD26 citations87