Inventor
LIEW WEE K
US5 patents
Patents
5 patentsUS6512293B1Jan 28, 2003
Mechanically interlocking ball grid array packages and method of making
LSI LOGIC CORP15 citations83
US6525421B1Feb 25, 2003
Molded integrated circuit package
LSI LOGIC CORP18 citations79
US6687133B1Feb 3, 2004
Ground plane on 2 layer PBGA
LSI LOGIC CORP11 citations69
US6825554B2Nov 30, 2004
PBGA electrical noise isolation of signal traces
LSI LOGIC CORP3 citations60
US6566167B1May 20, 2003
PBGA electrical noise isolation of signal traces
LSI LOGIC CORP4 citations60