Inventor

LIM HONG T

US4 patents

⚠️ This page may combine multiple inventors who share the name “LIM HONG T”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LSI CORP

2 patents

US7420809B2Sep 2, 2008

Heat spreader in integrated circuit package

LSI CORP33 citations91

US7235889B2Jun 26, 2007

Integrated heatspreader for use in wire bonded ball grid array semiconductor packages

LSI CORP6 citations61

LSI LOGIC CORP

2 patents

US6555914B1Apr 29, 2003

Integrated circuit package via

LSI LOGIC CORP7 citations72

US6687133B1Feb 3, 2004

Ground plane on 2 layer PBGA

LSI LOGIC CORP11 citations69