Inventor · disambiguated record
Seiji Yasui
Also filed as: YASUI SEIJI
13 granted patents·4 pending applications·327 citations·filing 1992–2019
93Inventor score
Top patents by PatentIndex Score
17 records- 0194US7760503B2Semiconductor module and inverter deviceAISIN AW CO·Filed 2008·Granted Jul 20, 2010·40 cites·20 claims
- 0292US7859103B2Semiconductor module and inverter deviceAISIN AW CO·Filed 2008·Granted Dec 28, 2010·28 cites·20 claims
- 0392US7663886B2Electric circuit device and the manufacturing methodAISIN AW CO·Filed 2007·Granted Feb 16, 2010·30 cites·18 claims
- 0491US7755898B2Semiconductor module and inverter deviceAISIN AW CO·Filed 2008·Granted Jul 13, 2010·24 cites·20 claims
- 0589US7569957B2Heating element cooling structure and drive device having the cooling structureAISINI AW CO LTD·Filed 2007·Granted Aug 4, 2009·30 cites·20 claims
- 0687US7728467B2Heat generating member cooling structure and drive unitAISIN AW CO·Filed 2008·Granted Jun 1, 2010·21 cites·19 claims
- 0787US6933531B1Heat sink material and method of manufacturing the heat sink materialNGK INSULATORS LTD·Filed 2000·Granted Aug 23, 2005·53 cites·38 claims
- 0883US5773042AInjection molding unit for long fiber-reinforced thermoplastic resinKOBE STEEL LTD·Filed 1995·Granted Jun 30, 1998·50 cites·19 claims
- 0972US5238147AMethod of metering molding compound and a metering system for carrying out the sameKOBE STEEL LTD·Filed 1992·Granted Aug 24, 1993·32 cites·3 claims
- 1064US6927421B2Heat sink materialNGK INSULATORS LTD·Filed 2002·Granted Aug 9, 2005·11 cites·35 claims
- 1163US7433187B2Heat spreader moduleNGK INSULATORS LTD·Filed 2004·Granted Oct 7, 2008·5 cites·2 claims
- 1262US11606056B2Inverter unitAISIN CORP·Filed 2019·Granted Mar 14, 2023·0 cites·9 claims
- 1348US6953539B2Composite materialNGK INSULATORS LTD·Filed 2002·Granted Oct 11, 2005·3 cites·8 claims
- 1441US2012118635A1Connection terminal and circuit componentTSURUOKA JUNJI·Filed 2011·Application pending·0 cites
- 1541US2013171891A1Connection terminal and circuit componentTSURUOKA JUNJI·Filed 2011·Application pending·0 cites
- 1635US2013105985A1Semiconductor deviceTSURUOKA JUNJI·Filed 2012·Application pending·0 cites
- 1735US2013113120A1Semiconductor device and manufacturing method of semiconductor deviceTSURUOKA JUNJI·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →