Inventor

PARK SOOMOON

KR10 patents

⚠️ This page may combine multiple inventors who share the name “PARK SOOMOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PARK SOOMOON

3 patents

US8569895B2Oct 29, 2013

Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die

PARK SOOMOON4 citations69

US8143096B2Mar 27, 2012

Integrated circuit package system flip chip

PARK SOOMOON4 citations60

US8193036B2Jun 5, 2012

Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die

PARK SOOMOON0 citations48

SAMSUNG ELECTRONICS CO LTD

3 patents

US12596251B2Apr 7, 2026

Optical device for exit pupil expansion (EPE) and display apparatus including the optical device

SAMSUNG ELECTRONICS CO LTD0 citations50

US12196969B2Jan 14, 2025

Display device

SAMSUNG ELECTRONICS CO LTD0 citations48

US12072535B2Aug 27, 2024

Display device

SAMSUNG ELECTRONICS CO LTD0 citations48

MOON DONGSOO

2 patents

US8115293B2Feb 14, 2012

Integrated circuit packaging system with interconnect and method of manufacture thereof

MOON DONGSOO26 citations89

US8692365B2Apr 8, 2014

Integrated circuit packaging system with thermal dispersal structures and method of manufacture thereof

MOON DONGSOO0 citations39

STATS CHIPPAC LTD

2 patents

US8785251B2Jul 22, 2014

Semiconductor device and method of forming mold underfill using dispensing needle having same width as semiconductor die

STATS CHIPPAC LTD4 citations82

US7682872B2Mar 23, 2010

Integrated circuit package system with underfill

STATS CHIPPAC LTD4 citations60