Inventor

REDDING GARY D

US34 patents

⚠️ This page may combine multiple inventors who share the name “REDDING GARY D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

REDDING GARY D

XEROX CORP

Precision laser cutting of adhesive members

Pin-actuated printhead

Printhead layer design for compatibility with wet adhesive application processes

Method of forming two-dimensional and three-dimensional semiconductor chip arrays

Multi-layer electroformed nozzle plate with attenuation pockets

Electrostatic device improved membrane bonding

Method for protecting piezoelectric transducer

Filament heaters configured to facilitate thermal treatment of filaments for extruder heads in three-dimensional object printers

System and method for cooling digital mirror devices

Plurality of linear sensor arrays comprising plural process direction widths and photosites with submicron y-axis alignment between arrays

Imaging blanket and variable data lithography system employing the imaging blanket

Surface treated additive manufacturing printhead nozzles and methods for the same

Flex circuit board with topographical structures to facilitate fluid flow through the layer

Filament heaters configured to facilitate thermal treatment of filaments for extruder heads in three-dimensional object printers

Electrostatic actuator with short circuit protection and process

Structure and method to fabricate tooling for bumping thin flex circuits

Method of fabricating a plurality of linear arrays with submicron y-axis alignment

Raised fluid pass-through structure in print heads

Raised fluid pass-through structure in print heads

Lead-free piezo printhead using thinned bulk material

Lead-free piezo printhead using thinned bulk material

Extrusion printheads for three-dimensional object printers

Method of forming piezo driver electrodes

Method of manufacturing ink jet printheads including electrostatic actuators

Membrane bond alignment for electrostatic ink jet printhead

Printhead configured to refill nozzle areas with high viscosity materials

REDDING GARY D

Printhead fabrication using additive manufacturing techniques

Process for adding thermoset layer to piezoelectric printhead

Print head transducer dicing directly on diaphragm

Polymer film as an interstitial fill for PZT printhead fabrication

DOLAN BRYAN R

Method for interstitial polymer planarization using a flexible flat plate

Interstitial material to enable robust electrical interconnect for high density piezoelectric arrays

NYSTROM PETER J

High density electrical interconnect for printing devices using flex circuits and dielectric underfill

WEN XUEJIN

High density three-dimensional electrical interconnections