Inventor
OTSUKA YOSHITAKA
JP17 patents
⚠️ This page may combine multiple inventors who share the name “OTSUKA YOSHITAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOKYO ELECTRON LTD
10 patentsUS10438920B2Oct 8, 2019
Bonding apparatus, bonding system, bonding method and storage medium
TOKYO ELECTRON LTD12 citations82
US12198963B2Jan 14, 2025
Bonding system
TOKYO ELECTRON LTD2 citations73
US10160015B2Dec 25, 2018
Foreign substance removal apparatus and foreign substance detection apparatus
TOKYO ELECTRON LTD2 citations72
US10985132B2Apr 20, 2021
Bonding apparatus, bonding system, bonding method and storage medium
TOKYO ELECTRON LTD4 citations71
US10946419B2Mar 16, 2021
Foreign substance removal apparatus and foreign substance detection apparatus
TOKYO ELECTRON LTD0 citations62
US11817338B2Nov 14, 2023
Bonding system and bonding method
TOKYO ELECTRON LTD1 citations61
US11417543B2Aug 16, 2022
Bonding apparatus and bonding method
TOKYO ELECTRON LTD1 citations60
US12451374B2Oct 21, 2025
Bonding system and inspection method of inspecting combined substrate
TOKYO ELECTRON LTD0 citations55
US10756046B2Aug 25, 2020
Bonding apparatus, bonding system, bonding method and storage medium
TOKYO ELECTRON LTD0 citations50
US10833045B2Nov 10, 2020
Substrate processing apparatus and manufacturing method of substrate holding unit
TOKYO ELECTRON LTD0 citations40
OLYMPUS CORP
5 patentsUS9158037B2Oct 13, 2015
Resin molded product, method of manufacturing the same, die for resin molded product
OLYMPUS CORP16 citations80
US9925705B2Mar 27, 2018
Molding die structure of molded article and manufacturing method of molded article
OLYMPUS CORP5 citations72
US9221222B2Dec 29, 2015
Molding die for multicolored molding, molding method of multicolored molded piece, and multicolored molded piece
OLYMPUS CORP2 citations54
US10882234B2Jan 5, 2021
Mold
OLYMPUS CORP0 citations51
US10022926B2Jul 17, 2018
Injection molding method and injection molding die
OLYMPUS CORP0 citations31