Inventor
LEE SHIH-YI
TW10 patents
⚠️ This page may combine multiple inventors who share the name “LEE SHIH-YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
XINTEC INC
7 patentsUS9640405B2May 2, 2017
Chip package having a laser stop structure
XINTEC INC2 citations72
US9543233B2Jan 10, 2017
Chip package having a dual through hole redistribution layer structure
XINTEC INC3 citations72
US9831185B2Nov 28, 2017
Chip package and fabrication method thereof
XINTEC INC0 citations51
US9780050B2Oct 3, 2017
Method of fabricating chip package with laser
XINTEC INC0 citations51
US9768067B2Sep 19, 2017
Chip package and manufacturing method thereof
XINTEC INC0 citations51
US9853074B2Dec 26, 2017
Chip scale sensing chip package
XINTEC INC0 citations46
US9721911B2Aug 1, 2017
Chip package and manufacturing method thereof
XINTEC INC0 citations41