Inventor
KIM JONG-KOOK
KR22 patents
⚠️ This page may combine multiple inventors who share the name “KIM JONG-KOOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
STATS CHIPPAC LTD
6 patentsUS7271496B2Sep 18, 2007
Integrated circuit package-in-package system
STATS CHIPPAC LTD29 citations92
US7429798B2Sep 30, 2008
Integrated circuit package-in-package system
STATS CHIPPAC LTD11 citations84
US7909233B2Mar 22, 2011
Method of manufacturing a semiconductor package with fine pitch lead fingers
STATS CHIPPAC LTD7 citations83
US7731078B2Jun 8, 2010
Semiconductor system with fine pitch lead fingers
STATS CHIPPAC LTD7 citations72
US7652382B2Jan 26, 2010
Micro chip-scale-package system
STATS CHIPPAC LTD0 citations52
US7298052B2Nov 20, 2007
Micro chip-scale-package system
STATS CHIPPAC LTD0 citations52
CHIPPAC INC
4 patentsLEE HUN TEAK
3 patentsUS9129826B2Sep 8, 2015
Epoxy bump for overhang die
LEE HUN TEAK6 citations71
US8519517B2Aug 27, 2013
Semiconductor system with fine pitch lead fingers and method of manufacturing thereof
LEE HUN TEAK0 citations50
US8256660B2Sep 4, 2012
Semiconductor package system with fine pitch lead fingers and method of manufacturing thereof
LEE HUN TEAK0 citations50