Inventor

DISCHLER RICHARD J

US16 patents

⚠️ This page may combine multiple inventors who share the name “DISCHLER RICHARD J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

15 patents

US10228735B2Mar 12, 2019

Methods of direct cooling of packaged devices and structures formed thereby

INTEL CORP18 citations85

US10263312B2Apr 16, 2019

Plurality of dielectric waveguides including dielectric waveguide cores for connecting first and second server boards

INTEL CORP3 citations73

US11026351B2Jun 1, 2021

Waveguide comprising a dielectric waveguide core surrounded by a conductive layer, where the core includes multiple spaces void of dielectric

INTEL CORP0 citations62

US11024933B2Jun 1, 2021

Waveguide comprising an extruded dielectric waveguide core that is coextruded with an outer conductive layer

INTEL CORP0 citations62

US10950919B2Mar 16, 2021

System comprising first and second servers interconnected by a plurality of joined waveguide sections

INTEL CORP0 citations62

US10249925B2Apr 2, 2019

Dielectric waveguide bundle including a supporting feature for connecting first and second server boards

INTEL CORP1 citations62

US11153105B2Oct 19, 2021

Technologies for densely packaging network components for large scale indirect topologies

INTEL CORP0 citations61

US10891254B2Jan 12, 2021

Switchable topology processor tile and computing machine

INTEL CORP0 citations61

US11269805B2Mar 8, 2022

Signal pathways in multi-tile processors

INTEL CORP0 citations51

US10498379B2Dec 3, 2019

Wireless interconnects on flexible cables between computing platforms

INTEL CORP0 citations51

COMPAQ COMPUTER CORP

1 patent

US6311287B1Oct 30, 2001

Variable frequency clock control for microprocessor-based computer systems

COMPAQ COMPUTER CORP168 citations95

DISCHLER RICHARD J

INTEL CORP

Methods of direct cooling of packaged devices and structures formed thereby

Plurality of dielectric waveguides including dielectric waveguide cores for connecting first and second server boards

Computing apparatus with closed cooling loop

Rlink—die to die channel interconnect configurations to improve signaling

Thermal management component

Methods for conductively coating millimeter waveguides

Methods for conductively coating millimeter waveguides

Waveguide comprising a dielectric waveguide core surrounded by a conductive layer, where the core includes multiple spaces void of dielectric

Waveguide comprising an extruded dielectric waveguide core that is coextruded with an outer conductive layer

System comprising first and second servers interconnected by a plurality of joined waveguide sections

Dielectric waveguide bundle including a supporting feature for connecting first and second server boards

Technologies for densely packaging network components for large scale indirect topologies

Switchable topology processor tile and computing machine

Signal pathways in multi-tile processors

Wireless interconnects on flexible cables between computing platforms

COMPAQ COMPUTER CORP

Variable frequency clock control for microprocessor-based computer systems