Inventor
BETSUI TAKAFUMI
JP32 patents
⚠️ This page may combine multiple inventors who share the name “BETSUI TAKAFUMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RENESAS ELECTRONICS CORP
28 patentsUS10043755B2Aug 7, 2018
Electronic device
RENESAS ELECTRONICS CORP3 citations73
US9990981B2Jun 5, 2018
Synchronous dynamic random access memory (SDRAM) and memory controller device mounted in single system in package (SIP)
RENESAS ELECTRONICS CORP3 citations73
US9991221B2Jun 5, 2018
Semiconductor integrated circuit device
RENESAS ELECTRONICS CORP4 citations73
US9818715B2Nov 14, 2017
Semiconductor integrated circuit device
RENESAS ELECTRONICS CORP3 citations73
US9558806B1Jan 31, 2017
Electronic device
RENESAS ELECTRONICS CORP6 citations73
US8898613B2Nov 25, 2014
Data processing device
RENESAS ELECTRONICS CORP3 citations73
US8386992B2Feb 26, 2013
Data processing device
RENESAS ELECTRONICS CORP3 citations73
US9123554B2Sep 1, 2015
Semiconductor device
RENESAS ELECTRONICS CORP7 citations71
US12015020B2Jun 18, 2024
Semiconductor device and power management IC
RENESAS ELECTRONICS CORP0 citations62
US11742336B2Aug 29, 2023
Semiconductor device and power management IC
RENESAS ELECTRONICS CORP0 citations62
US10446531B2Oct 15, 2019
Electronic device and semiconductor device
RENESAS ELECTRONICS CORP1 citations62
US9530457B2Dec 27, 2016
Data processing device
RENESAS ELECTRONICS CORP2 citations62
US7834455B2Nov 16, 2010
Semiconductor device
RENESAS ELECTRONICS CORP2 citations61
US11658081B2May 23, 2023
Semiconductor apparatus and semiconductor device
RENESAS ELECTRONICS CORP0 citations56
US9190378B2Nov 17, 2015
Semiconductor chip and semiconductor device
RENESAS ELECTRONICS CORP3 citations55
US12278198B2Apr 15, 2025
Semiconductor device on wiring board having reference potential planes with openings
RENESAS ELECTRONICS CORP0 citations52
US10460792B2Oct 29, 2019
Synchronous dynamic random access memory (SDRAM) and memory controller device mounted in single system in package (SIP)
RENESAS ELECTRONICS CORP0 citations52
US10249560B2Apr 2, 2019
Semiconductor device, system in package, and system in package for vehicle
RENESAS ELECTRONICS CORP0 citations52
US10153245B2Dec 11, 2018
Semiconductor device
RENESAS ELECTRONICS CORP0 citations52
US10123426B2Nov 6, 2018
Semiconductor integrated circuit device, printed board and manufacturing method of the semiconductor integrated circuit device
RENESAS ELECTRONICS CORP0 citations52
US9839130B1Dec 5, 2017
Semiconductor integrated circuit device, printed board and manufacturing method of the semiconductor integrated circuit device
RENESAS ELECTRONICS CORP1 citations52
US9831209B2Nov 28, 2017
Semiconductor device
RENESAS ELECTRONICS CORP0 citations52
US9673142B2Jun 6, 2017
Semiconductor device
RENESAS ELECTRONICS CORP1 citations52
US10726878B2Jul 28, 2020
Data processing device
RENESAS ELECTRONICS CORP0 citations51
US10020028B2Jul 10, 2018
Data processing device
RENESAS ELECTRONICS CORP0 citations51
US9792959B2Oct 17, 2017
Data processing device
RENESAS ELECTRONICS CORP0 citations51
US8694949B2Apr 8, 2014
Data processing device
RENESAS ELECTRONICS CORP0 citations51
US10103100B2Oct 16, 2018
Semiconductor device
RENESAS ELECTRONICS CORP0 citations31