Inventor
LIN ANG-YING
TW9 patents
Patents
9 patentsUS11004816B2May 11, 2021
Hetero-integrated structure
IND TECH RES INST3 citations72
US11424190B2Aug 23, 2022
Multi-chip package and manufacture method thereof
IND TECH RES INST2 citations71
US11251174B2Feb 15, 2022
Image sensor package and manufacturing method thereof
IND TECH RES INST2 citations71
US12074137B2Aug 27, 2024
Multi-chip package and manufacturing method thereof
IND TECH RES INST0 citations60
US11646270B2May 9, 2023
Multi-chip package and manufacturing method thereof
IND TECH RES INST0 citations60
US11587905B2Feb 21, 2023
Multi-chip package and manufacturing method thereof
IND TECH RES INST0 citations60
US11569217B2Jan 31, 2023
Image sensor package and manufacturing method thereof
IND TECH RES INST0 citations60
US12027470B2Jul 2, 2024
Package carrier having a stiffener between solder bumps
IND TECH RES INST1 citations58
US12009341B2Jun 11, 2024
Integrated antenna package structure
IND TECH RES INST0 citations48