Inventor
NI TZU-HSUAN
TW6 patents
Patents
6 patentsUS11424190B2Aug 23, 2022
Multi-chip package and manufacture method thereof
IND TECH RES INST2 citations71
US11251174B2Feb 15, 2022
Image sensor package and manufacturing method thereof
IND TECH RES INST2 citations71
US12074137B2Aug 27, 2024
Multi-chip package and manufacturing method thereof
IND TECH RES INST0 citations60
US11646270B2May 9, 2023
Multi-chip package and manufacturing method thereof
IND TECH RES INST0 citations60
US11587905B2Feb 21, 2023
Multi-chip package and manufacturing method thereof
IND TECH RES INST0 citations60
US11569217B2Jan 31, 2023
Image sensor package and manufacturing method thereof
IND TECH RES INST0 citations60