Inventor
BRUN XAVIER
US12 patents
⚠️ This page may combine multiple inventors who share the name “BRUN XAVIER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
10 patentsUS11756860B2Sep 12, 2023
Semiconductor device stack-up with bulk substrate material to mitigate hot spots
INTEL CORP3 citations71
US12532740B2Jan 20, 2026
Porous mesh structures for the thermal management of integrated circuit devices
INTEL CORP0 citations62
US12444672B2Oct 14, 2025
Hybrid bonding technologies with thermal expansion compensation structures
INTEL CORP0 citations61
US12341080B2Jun 24, 2025
Semiconductor device stack-up with bulk substrate material to mitigate hot spots
INTEL CORP0 citations61
US12021016B2Jun 25, 2024
Thermally enhanced silicon back end layers for improved thermal performance
INTEL CORP0 citations61
US11978689B2May 7, 2024
Semiconductor device stack-up with bulk substrate material to mitigate hot spots
INTEL CORP0 citations61
US12080620B2Sep 3, 2024
Additively manufactured structures for heat dissipation from integrated circuit devices
INTEL CORP0 citations50
US9793151B2Oct 17, 2017
Stiffener tape for electronic assembly
INTEL CORP0 citations50
US9659889B2May 23, 2017
Solder-on-die using water-soluble resist system and method
INTEL CORP0 citations46
US12002727B2Jun 4, 2024
Barrier structures for underfill containment
INTEL CORP0 citations44