Inventor

TSAI PO-HAO

TW238 patents

⚠️ This page may combine multiple inventors who share the name “TSAI PO-HAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TSAI PO-HAO

TAIWAN SEMICONDUCTOR MFG CO LTD

Release film as isolation film in package

Package on package (PoP) bonding structures

Integrated fan-out structure with guiding trenches in buffer layer

Integrated fan-out packages and methods of forming the same

Interconnect structure for package-on-package devices and a method of fabricating

Semiconductor device and method of manufacture

Backside redistribution layer (RDL) structure

Semiconductor packages and methods of forming the same

Interconnect structure for package-on-package devices and a method of fabricating

Mechanisms for forming package structure

Integrated circuit package and method

Underfill between a first package and a second package

Fan-out packages and methods of forming the same

Fan-out package with controllable standoff

Integrated circuit package and method

Release film as isolation film in package

Fan-out package with cavity substrate

Package structure with dam structure and method for forming the same

Interconnect structure for package-on-package devices

Semiconductor device and method of manufacture

Semiconductor device and method of manufacture

Package structure and manufacturing method thereof

Backside redistribution layer (RDL) structure

Method for forming chip package structure

InFO-POP structures with TIVs having cavities

Method for forming chip package with recessed interposer substrate

Interconnect structure for package-on-package devices

Semiconductor device and method of manufacture

Package and manufacturing method thereof

Interconnect structure for package-on-package devices

Package structure and method of forming thereof

Semiconductor packages and methods of forming the same

Packaged semiconductor devices and packaging devices and methods

Chip package structure and method for forming the same

Semiconductor device and method of manufactures

Chip package structure with adhesive layer

Semiconductor package manufacturing method

Multi-die structure and method of forming same

Semiconductor device and method of manufacture

Semiconductor device and method

Integrated fan-out structure with guiding trenches in buffer layer

TAIWAN SEMICONDUCTOR MFG

Method of fabricating interconnect structure for package-on-package devices

Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devices

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Fan out package, semiconductor device and manufacturing method thereof

Package on package (PoP) bonding structures

TAIWAN SEMICONDUCTOR MANFACTURING COMPANY LTD

Packaged semiconductor devices and packaging devices and methods

YU CHEN-HUA

Connector design for packaging integrated circuits

TSAI PO-HAO

TSVs with different sizes in interposers for bonding dies