P

Inventor

DAI HUIXIONG

US44 patents
⚠️ This page may combine multiple inventors who share the name “DAI HUIXIONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLIED MATERIALS INC

34 patents
US9761489B2Sep 12, 2017

Self-aligned interconnects formed using substractive techniques

APPLIED MATERIALS INC20 citations92
US9748148B2Aug 29, 2017

Localized stress modulation for overlay and EPE

APPLIED MATERIALS INC8 citations84
US9716012B2Jul 25, 2017

Methods of selective layer deposition

APPLIED MATERIALS INC15 citations84
US9478421B2Oct 25, 2016

Optically tuned hardmask for multi-patterning applications

APPLIED MATERIALS INC6 citations84
US9411237B2Aug 9, 2016

Resist hardening and development processes for semiconductor device manufacturing

APPLIED MATERIALS INC11 citations84
US9177796B2Nov 3, 2015

Optically tuned hardmask for multi-patterning applications

APPLIED MATERIALS INC7 citations84
US8357618B2Jan 22, 2013

Frequency doubling using a photo-resist template mask

APPLIED MATERIALS INC9 citations84
US10234772B2Mar 19, 2019

Overlay error correction

APPLIED MATERIALS INC5 citations80
US11437284B2Sep 6, 2022

Contact over active gate structure

APPLIED MATERIALS INC2 citations73
US10930555B2Feb 23, 2021

Contact over active gate structure

APPLIED MATERIALS INC2 citations73
US10643895B2May 5, 2020

Self-aligned interconnects formed using subtractive techniques

APPLIED MATERIALS INC5 citations73
US9815091B2Nov 14, 2017

Roll to roll wafer backside particle and contamination removal

APPLIED MATERIALS INC2 citations73
US9728406B2Aug 8, 2017

Multi materials and selective removal enabled reverse tone process

APPLIED MATERIALS INC4 citations73
US11429026B2Aug 30, 2022

Lithography process window enhancement for photoresist patterning

APPLIED MATERIALS INC2 citations72
US9343309B1May 17, 2016

Lateral oxidation process flows

APPLIED MATERIALS INC5 citations68
US12372874B2Jul 29, 2025

System architecture of manufacturing of semiconductor wafers

APPLIED MATERIALS INC0 citations62
US12201030B2Jan 14, 2025

Spin-orbit torque MRAM structure and manufacture thereof

APPLIED MATERIALS INC0 citations62
US12198985B2Jan 14, 2025

Contact over active gate structure

APPLIED MATERIALS INC0 citations62
US11723283B2Aug 8, 2023

Spin-orbit torque MRAM structure and manufacture thereof

APPLIED MATERIALS INC0 citations62
US10957590B2Mar 23, 2021

Method for forming a layer

APPLIED MATERIALS INC0 citations62
US10930556B2Feb 23, 2021

Contact over active gate structure

APPLIED MATERIALS INC1 citations62
US9337051B2May 10, 2016

Method for critical dimension reduction using conformal carbon films

APPLIED MATERIALS INC2 citations62
US7901869B2Mar 8, 2011

Double patterning with a double layer cap on carbonaceous hardmask

APPLIED MATERIALS INC4 citations62
US11914299B2Feb 27, 2024

Lithography process window enhancement for photoresist patterning

APPLIED MATERIALS INC0 citations61
US11650506B2May 16, 2023

Film structure for electric field guided photoresist patterning process

APPLIED MATERIALS INC0 citations61
US10825665B2Nov 3, 2020

Directional treatment for multi-dimensional device processing

APPLIED MATERIALS INC1 citations61
US11880137B2Jan 23, 2024

Film structure for electric field guided photoresist patterning process

APPLIED MATERIALS INC0 citations60
US10927451B2Feb 23, 2021

Methods and apparatus for patterning substrates using asymmetric physical vapor deposition

APPLIED MATERIALS INC0 citations52
US11313034B2Apr 26, 2022

Methods for depositing amorphous silicon layers or silicon oxycarbide layers via physical vapor deposition

APPLIED MATERIALS INC0 citations51
US10927450B2Feb 23, 2021

Methods and apparatus for patterning substrates using asymmetric physical vapor deposition

APPLIED MATERIALS INC0 citations51
US12204246B2Jan 21, 2025

Metal oxide resist patterning with electrical field guided post-exposure bake

APPLIED MATERIALS INC0 citations50
US12085858B2Sep 10, 2024

Photoresist patterning process

APPLIED MATERIALS INC0 citations50
US9864280B2Jan 9, 2018

Overlay error correction

APPLIED MATERIALS INC1 citations48
US11609505B2Mar 21, 2023

Apparatus and methods for verification and re-use of process fluids

APPLIED MATERIALS INC0 citations46

VARIAN SEMICONDUCTOR EQUIPMENT ASS INC

8 patents

DAI HUIXIONG

1 patent

CHEN HUI W

1 patent