Inventor
KAGAMIDA TAKESHI
JP8 patents
Patents
8 patentsUS5658189AAug 19, 1997
Grinding apparatus for wafer edge
TOKYO SEIMITSU CO LTD103 citations96
US5609514AMar 11, 1997
Wafer chamfering machine
TOKYO SEIMITSU CO LTD32 citations92
US5427644AJun 27, 1995
Method of manufacturing semiconductor wafer and system therefor
TOKYO SEIMITSU CO LTD33 citations90
US5759344AJun 2, 1998
Wafer slicer base peeling system
TOKYO SEIMITSU CO LTD4 citations73
US5582536ADec 10, 1996
Apparatus and method for manufacturing wafer
TOKYO SEIMITSU CO LTD11 citations72
US5555091ASep 10, 1996
Wafer diameter/sectional shape measuring machine
TOKYO SEIMITSU CO LTD13 citations72
US5853533ADec 29, 1998
Wafer slice base peeling system
TOKYO SEIMITSU CO LTD1 citations62
US5849147ADec 15, 1998
Wafer slice base peeling system
TOKYO SEIMITSU CO LTD2 citations62