Inventor
LOW OWAI H
US3 patents
Patents
3 patentsUS6002169ADec 14, 1999
Thermally enhanced tape ball grid array package
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US6670214B1Dec 30, 2003
Insulated bonding wire for microelectronic packaging
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US6991147B2Jan 31, 2006
Insulated bonding wire tool for microelectronic packaging
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