Inventor
LEE MENG-TSANG
TW3 patents
Patents
3 patentsUS6627481B2Sep 30, 2003
Method of manufacturing a semiconductor package with a lead frame having a support structure
ADVANCED SEMICONDUCTOR ENG7 citations68
US6942478B2Sep 13, 2005
Packaging mold with electrostatic discharge protection
ADVANCED SEMICONDUCTOR ENG1 citations47
US6777793B2Aug 17, 2004
Packaging substrate with electrostatic discharge protection
ADVANCED SEMICONDUCTOR ENG0 citations36