Inventor

CHAW CHI CHUEN

CN2 patents

Patents

2 patents

US7329617B2Feb 12, 2008

Coating for enhancing adhesion of molding compound to semiconductor devices

ASM ASSEMBLY AUTOMATION LTD14 citations79

US7458495B2Dec 2, 2008

Flip chip bonding tool

ASM ASSEMBLY AUTOMATION LTD6 citations70