Inventor

EIFUKU HIDEKI

JP24 patents

⚠️ This page may combine multiple inventors who share the name “EIFUKU HIDEKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

EIFUKU HIDEKI

PANASONIC CORP

Electronic component mounting method

Method of mounting electronic components

Circuit board interconnection structure and circuit board interconnection method

Components joining method and components joining structure

Electric components connecting method

Electronic components mounting adhesive and electronic components mounting structure

Method for manufacturing electronic parts module

Electronic component mounting method

Electrode joining method, production method of electrode joined structure

Method for manufacturing electronic parts module

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

Method of mounting bumped electronic components

Method of soldering bumped work by partially penetrating the oxide film covering the solder bumps

Electronic parts mounting method

Mounting structure of electronic component having bumps

Semiconductor chip bonding method

PANASONIC IP MAN CO LTD

Electric component mounting method

Component-mounted structure

Manufacturing method of electronic component, electronic component, and manufacturing apparatus of electronic component

MOTOMURA KOJI

Electronic component mounting system and electronic component mounting method

Electronic component mounting system and electronic component mounting method

SAKAI TADAHIKO

Connecting method of electronic component

Components joining method and components joining structure

OZONO MITSURU

Electronic component soldering structure and electronic component soldering method

MARUO HIROKI

Substrate backing device and substrate thermocompression-bonding device