Inventor

KITADE KEITA

JP4 patents

⚠️ This page may combine multiple inventors who share the name “KITADE KEITA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TOKYO SEIMITSU CO LTD

3 patents

US7795865B2Sep 14, 2010

Method of forecasting and detecting polishing endpoint and the device thereof and real time film thickness monitoring method and the device thereof

TOKYO SEIMITSU CO LTD8 citations82

US7830141B2Nov 9, 2010

Film thickness measuring apparatus and film thickness measuring method

TOKYO SEIMITSU CO LTD7 citations71

US7821257B2Oct 26, 2010

Method and device for forecasting/detecting polishing end point and method and device for monitoring real-time film thickness

TOKYO SEIMITSU CO LTD4 citations60

FUJITA TAKASHI

1 patent

US8173037B2May 8, 2012

Wafer polish monitoring method and device

FUJITA TAKASHI0 citations50